Inventor · disambiguated record
Timothy Takeuchi
Also filed as: TAKEUCHI TIMOTHY M
3 granted patents·4 pending applications·42 citations·filing 1999–2006
72Inventor score
Top patents by PatentIndex Score
7 records- 0178US7098080B2Method of making a semiconductor package with integrated heat spreader attached to a thermally conductive substrate coreINTEL CORP·Filed 2006·Granted Aug 29, 2006·10 cites·6 claims
- 0273US7042084B2Semiconductor package with integrated heat spreader attached to a thermally conductive substrate coreINTEL CORP·Filed 2002·Granted May 9, 2006·23 cites·23 claims
- 0336US6441480B1Microelectronic circuit packageINTEL CORP·Filed 1999·Granted Aug 27, 2002·9 cites·22 claims
- 0435US2006289202A1Stacked microvias and method of manufacturing sameINTEL CORP·Filed 2005·Application pending·0 cites
- 0530US2005218528A1Capillary underfill channelBEATTY JOHN J·Filed 2004·Application pending·0 cites
- 0629US2006214313A1Die attach methods and apparatusPIEDA RUEL B·Filed 2005·Application pending·0 cites
- 0729US2006060845A1Bond pad redistribution layer for thru semiconductor vias and probe touchdownRAMANUJA NARAHARI·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →