Inventor · disambiguated record
Tien Lai Tan
Also filed as: TAN TIEN LAI
6 granted patents·38 citations·filing 2005–2009
79Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0189US8030131B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2009·Granted Oct 4, 2011·17 cites·13 claims
- 0279US7727813B2Method for making a device including placing a semiconductor chip on a substrateINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 1, 2010·9 cites·10 claims
- 0364US8642394B2Method of manufacturing electronic device on leadframeMOHAMED ABDUL RAHMAN·Filed 2008·Granted Feb 4, 2014·5 cites·17 claims
- 0464US7791182B2Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producingINFINEON TECHNOLOGIES AG·Filed 2005·Granted Sep 7, 2010·5 cites·17 claims
- 0558US8120161B2Semiconductor module including semiconductor chips coupled to external contact elementsOTREMBA RALF·Filed 2007·Granted Feb 21, 2012·2 cites·23 claims
- 0644US7701065B2Device including a semiconductor chip having a plurality of electrodesINFINEON TECHNOLOGIES AG·Filed 2007·Granted Apr 20, 2010·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →