Inventor · disambiguated record
Tingyu Wang
Also filed as: WANG TINGYU
6 granted patents·2 citations·filing 2021–2024
68Inventor score
Top patents by PatentIndex Score
6 records- 0180US11860590B2Model-free optimization method of process parameters of injection moldingUNIV ZHEJIANG·Filed 2021·Granted Jan 2, 2024·1 cites·9 claims
- 0270US12111152B2Magnetic flexible tactile sensing structure and application based on folding magnetization methodUNIV ZHEJIANG·Filed 2022·Granted Oct 8, 2024·0 cites·20 claims
- 0352USD1090379SFront bumperWANG TINGYU·Filed 2024·Granted Aug 26, 2025·1 cites·1 claims
- 0436USD1091405SFront bumperWANG TINGYU·Filed 2024·Granted Sep 2, 2025·0 cites·1 claims
- 0536USD1091407SFront bumperWANG TINGYU·Filed 2024·Granted Sep 2, 2025·0 cites·1 claims
- 0636USD1091406SFront bumperWANG TINGYU·Filed 2024·Granted Sep 2, 2025·0 cites·1 claims
Join the waitlist — get patent alerts
Get an alert when Tingyu Wang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →