Inventor · disambiguated record
Tiwei Wei
Also filed as: WEI TIWEI
0 granted patents·5 pending applications·0 citations·filing 2015–2025
Top patents by PatentIndex Score
5 records- 0167US2025360692A1Multilayered metallic microstructurePURDUE RESEARCH FOUNDATION·Filed 2025·Application pending·0 cites
- 0258US2025364365A1Cooling arrangement for a backside power delivery networkPURDUE RESEARCH FOUNDATION·Filed 2025·Application pending·0 cites
- 0347US2025349669A1Liquid Jet Impingement CoolerPURDUE RESEARCH FOUNDATION·Filed 2025·Application pending·0 cites
- 0444US2025364484A1Bonding arrangement having a metal inverse opals layerPURDUE RESEARCH FOUNDATION·Filed 2025·Application pending·0 cites
- 0533US2017323849A1Adapter panel and manufacturing method and encapsulation structure thereof and bonding method for the adapter panelUNIV TSINGHUA·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →