Inventor · disambiguated record
Tien-Chi Wu
Also filed as: WU TIEN-CHI
7 granted patents·3 pending applications·53 citations·filing 2002–2023
84Inventor score
Files withTAIWAN SEMICONDUCTOR MFG6CHROMA ATE INC1TAIWAN COLOUR & IMAGING TECH CORP1TAIWAN SEMICONDUCTOR MFG CO LTD1WU TIEN-CHI1
Top patents by PatentIndex Score
10 records- 0193US8736007B2Method for forming structure for reducing noise in CMOS image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 27, 2014·14 cites·16 claims
- 0287US7196388B2Microlens designs for CMOS image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Mar 27, 2007·14 cites·18 claims
- 0382US9263486B2Method for forming structure for reducing noise in CMOS image sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 16, 2016·2 cites·18 claims
- 0480US7919827B2Method and structure for reducing noise in CMOS image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Apr 5, 2011·5 cites·13 claims
- 0560US6927345B2Guard ring having electrically isolated lightening barsTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 9, 2005·10 cites·16 claims
- 0658US7049157B2Calibration standard for critical dimension verification of sub-tenth micron integrated circuit technologyTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 23, 2006·8 cites·18 claims
- 0755US8283196B2Method for forming structure for reducing noise in CMOS image sensorsWU TIEN-CHI·Filed 2011·Granted Oct 9, 2012·0 cites·12 claims
- 0852US2024102860A1Six-degree-of-freedom error correction method and apparatusCHROMA ATE INC·Filed 2023·Application pending·0 cites
- 0931US2004110365A1Method of forming a planarized bond pad structureTAIWAN SEMICONDUCTOR MFG·Filed 2002·Application pending·0 cites
- 1021US2017011265A1Monitoring method for regionTAIWAN COLOUR & IMAGING TECH CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →