Inventor · disambiguated record
Ting-Yeh Wu
Also filed as: WU TING-YEH
3 granted patents·0 citations·filing 2020–2020
39Inventor score
Files withPOWERTECH TECHNOLOGY INC3
Top patents by PatentIndex Score
3 records- 0151US11410945B2Semiconductor package having partial outer metal layer and packaging method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted Aug 9, 2022·0 cites·5 claims
- 0245US11658046B2Semiconductor packaging structure with back-deposited shielding layer and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2020·Granted May 23, 2023·0 cites·7 claims
- 0343US11587808B2Chip carrier devicePOWERTECH TECHNOLOGY INC·Filed 2020·Granted Feb 21, 2023·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →