Inventor · disambiguated record
Tien Y. Wu
Also filed as: WU TIEN Y · WU TIEN YUE
10 granted patents·507 citations·filing 1993–2001
92Inventor score
Files withIBM10
Top patents by PatentIndex Score
10 records- 0194US5574630ALaminated electronic package including a power/ground assemblyIBM·Filed 1995·Granted Nov 12, 1996·189 cites·12 claims
- 0291US5491610AElectronic package having active means to maintain its operating temperature constantIBM·Filed 1994·Granted Feb 13, 1996·131 cites·10 claims
- 0371US5532024AMethod for improving the adhesion of polymeric adhesives to nickel surfacesIBM·Filed 1995·Granted Jul 2, 1996·36 cites·17 claims
- 0468US5442144AMultilayered circuit boardIBM·Filed 1994·Granted Aug 15, 1995·25 cites·7 claims
- 0567US6403882B1Protective cover plate for flip chip assembly backsideIBM·Filed 1997·Granted Jun 11, 2002·34 cites·24 claims
- 0667US6246124B1Encapsulated chip module and method of making sameIBM·Filed 1998·Granted Jun 12, 2001·30 cites·10 claims
- 0766US5359767AMethod of making multilayered circuit boardIBM·Filed 1993·Granted Nov 1, 1994·24 cites·13 claims
- 0859US6226187B1Integrated circuit packageIBM·Filed 1999·Granted May 1, 2001·21 cites·16 claims
- 0958US6558981B2Method for making an encapsulated semiconductor chip moduleIBM·Filed 2001·Granted May 6, 2003·7 cites·8 claims
- 1043US6084299AIntegrated circuit package including a heat sink and an adhesiveIBM·Filed 1995·Granted Jul 4, 2000·10 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →