Inventor · disambiguated record
Ting-Hau Wu
Also filed as: WU TING-HAU
32 granted patents·129 citations·filing 2008–2019
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG12TAIWAN SEMICONDUCTOR MFG CO LTD10WU TING-HAU7LEE JIOU-KANG1PENG JUNG-HUEI1
Top patents by PatentIndex Score
32 records- 0198US9238581B2Triple-axis MEMS accelerometerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 19, 2016·50 cites·20 claims
- 0297US9138994B2MEMS devices and methods of fabrication thereofPENG JUNG-HUEI·Filed 2010·Granted Sep 22, 2015·49 cites·20 claims
- 0387US8455999B2Method for reducing chip warpageWU TING-HAU·Filed 2011·Granted Jun 4, 2013·5 cites·20 claims
- 0479US8053336B2Method for reducing chip warpageTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Nov 8, 2011·5 cites·19 claims
- 0577US9502370B2Semiconductor bonding structure and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 22, 2016·2 cites·20 claims
- 0677US9281287B2Semiconductor bonding structure and processTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 8, 2016·3 cites·20 claims
- 0775US11104129B2MEMS devices and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 31, 2021·0 cites·20 claims
- 0871US8878355B2Semiconductor bonding structure and processTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Nov 4, 2014·2 cites·20 claims
- 0970US7998775B2Silicon undercut prevention in sacrificial oxide release process and resulting MEMS structuresTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Aug 16, 2011·3 cites·14 claims
- 1069US10688786B2MEMS devices and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·0 cites·20 claims
- 1168US8281658B2Method to produce 3-D optical gyroscope my MEMS technologyWU TING-HAU·Filed 2009·Granted Oct 9, 2012·3 cites·17 claims
- 1267US10889493B2MEMS method and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 12, 2021·0 cites·20 claims
- 1367US8237235B2Metal-ceramic multilayer structureWU TING-HAU·Filed 2010·Granted Aug 7, 2012·1 cites·27 claims
- 1466US8362578B2Triple-axis MEMS accelerometerTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jan 29, 2013·1 cites·19 claims
- 1563US8218286B2MEMS microphone with single polysilicon filmWU TING-HAU·Filed 2008·Granted Jul 10, 2012·2 cites·20 claims
- 1663US7923379B2Multi-step process for forming high-aspect-ratio holes for MEMS devicesTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Apr 12, 2011·2 cites·9 claims
- 1762US9950522B2MEMS devices and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 24, 2018·0 cites·20 claims
- 1860US10160642B2MEMS method and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 25, 2018·0 cites·20 claims
- 1960US8367516B2Laser bonding for stacking semiconductor substratesTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Feb 5, 2013·1 cites·24 claims
- 2059US9321632B2Socket type MEMS bondingTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 26, 2016·0 cites·20 claims
- 2157US9677884B2Methods of forming a gyroscope sensor and a structure for a gyroscope sensorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 13, 2017·0 cites·20 claims
- 2257US9394164B2MEMS method and structureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 19, 2016·0 cites·20 claims
- 2354US8987845B2Method for the prevention of suspended silicon structure etching during reactive ion etchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Mar 24, 2015·0 cites·20 claims
- 2453US8776600B2Gyroscope sensorsWU TING-HAU·Filed 2012·Granted Jul 15, 2014·0 cites·20 claims
- 2551US9156685B2Method for the prevention of suspended silicon structure etching during reactive ion etchingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 13, 2015·0 cites·20 claims
- 2651US7999257B2Process for eliminating delamination between amorphous silicon layersTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Aug 16, 2011·0 cites·19 claims
- 2749US8237263B2Method and apparatus for cooling an integrated circuitWU TING-HAU·Filed 2009·Granted Aug 7, 2012·0 cites·22 claims
- 2848US8309441B2Process for eliminating delamination between amorphous silicon layersLEE JIOU-KANG·Filed 2011·Granted Nov 13, 2012·0 cites·13 claims
- 2948US8053377B2Low stress photo-sensitive resin with sponge-like structure and devices manufactured employing sameTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Nov 8, 2011·0 cites·19 claims
- 3047US8563400B2Laser bonding for stacking semiconductor substratesTAIWAN SEMICONDUCTOR MANFUCATURING COMPANY LTD·Filed 2013·Granted Oct 22, 2013·0 cites·20 claims
- 3143US10023459B2MEMS and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 17, 2018·0 cites·20 claims
- 3239US8106470B2Triple-axis MEMS accelerometer having a bottom capacitorWU TING-HAU·Filed 2010·Granted Jan 31, 2012·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Ting-Hau Wu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →