Inventor · disambiguated record
Ting-Li Yang
Also filed as: Yang ting-li
19 granted patents·12 pending applications·21 citations·filing 2015–2025
91Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD26IBM2MEDIATEK INC2TAIWAN SEMICONDUCTOR MANUFACATURING CO LTD1
Top patents by PatentIndex Score
31 records- 0197US11908790B2Chip structure with conductive via structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·5 cites·20 claims
- 0295US11855028B2Hybrid micro-bump integration with redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·3 cites·20 claims
- 0395US11855017B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·4 cites·20 claims
- 0494US11955423B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 9, 2024·3 cites·20 claims
- 0593US11862588B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·2 cites·20 claims
- 0684US2025336866A1Bump integration with redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0783US2025349706A1Semiconductor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0881US2025309162A1Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0980US12368120B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
- 1078US12243837B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 1178US2024379605A1Hybrid micro-bump integration with redistribution layerTAIWAN SEMICONDUCTOR MANUFACATURING CO LTD·Filed 2024·Application pending·0 cites
- 1278US2024363569A1Bump integration with redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1377US12412857B2Hybrid micro-bump integration with redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 9, 2025·0 cites·20 claims
- 1477US12347722B2Semiconductor device structure with a protection cap at an end portion of a conductive lineTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·20 claims
- 1577US12266593B2Method of forming semiconductor device having at least one via including concave portions on sidewallTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·0 cites·20 claims
- 1675US11557508B2Semiconductor device structure having protection caps on conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 17, 2023·0 cites·20 claims
- 1775US10269703B2Semiconductor device and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·2 cites·20 claims
- 1875US9586281B2Forming a solder joint between metal layersIBM·Filed 2015·Granted Mar 7, 2017·2 cites·12 claims
- 1975US2024250019A1Semiconductor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2073US2025210467A1Semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2172US2025183204A1Semiconductor Device and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2270US12057423B2Bump integration with redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·20 claims
- 2370US2024153849A1Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2469US11942398B2Semiconductor device having at least one via including concave portions on sidewallTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·20 claims
- 2569US11851321B2Micro-electro mechanical system and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 2665US2022367347A1Chip structure with conductive via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2764US11901266B2Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 2863US2025079360A1Semiconductor structure and method for forming the sameMEDIATEK INC·Filed 2024·Application pending·0 cites
- 2961US2024387422A1Semiconductor structure and method for forming the sameMEDIATEK INC·Filed 2024·Application pending·0 cites
- 3057US10748810B2Method of manufacturing an integrated inductor with protections caps on conductive linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 18, 2020·0 cites·20 claims
- 3152US10252363B2Forming a solder joint between metal layersIBM·Filed 2017·Granted Apr 9, 2019·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →