Inventor · disambiguated record
Ting-Yu Yeh
Also filed as: YEH TING-YU
19 granted patents·13 pending applications·84 citations·filing 2015–2025
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD28AUXERGEN INC2TAIWAN SEMICONDUTOR MFG COMPANY LTD1YEH TING YU1
Top patents by PatentIndex Score
32 records- 0197US10867954B2Interconnect chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 15, 2020·14 cites·20 claims
- 0297US10720401B2Interconnect chipsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 21, 2020·18 cites·20 claims
- 0396US11990351B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 21, 2024·3 cites·20 claims
- 0494US11978714B2Encapsulated package including device dies connected via interconnect dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 7, 2024·1 cites·18 claims
- 0593US12272568B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 8, 2025·1 cites·20 claims
- 0693US9899305B1Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 20, 2018·30 cites·20 claims
- 0792US10304800B2Packaging with substrates connected by conductive bumpsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 28, 2019·10 cites·20 claims
- 0887US12334464B2Encapsulated package including device dies connected via interconnect dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·20 claims
- 0986US2025273614A1Encapsulated package including device dies connected via interconnect dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1083US10515869B1Semiconductor package structure having a multi-thermal interface material structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·2 cites·20 claims
- 1182US2024387197A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1281US12400989B2Arrangement of power-grounds in package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 26, 2025·0 cites·20 claims
- 1381US2025391797A1Arrangement of power-grounds in package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1479US2025201583A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1579US2024363483A1Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1678US11728238B2Semiconductor package with heat dissipation films and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 15, 2023·2 cites·21 claims
- 1778US2025349559A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1877US12315786B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 27, 2025·0 cites·20 claims
- 1977US12062590B2Method for manufacturing semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 13, 2024·1 cites·20 claims
- 2077US2025273550A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2175US2025364374A1Via connection structure having multiple via to via connectionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2274US11532585B2Package containing device dies and interconnect die and redistribution linesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·0 cites·20 claims
- 2372US11139282B2Semiconductor package structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 5, 2021·2 cites·20 claims
- 2470US11929340B2Arrangement of power-grounds in package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·0 cites·20 claims
- 2569US2024282589A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2668US12327781B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 10, 2025·0 cites·20 claims
- 2764US2022336321A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2860US2023386969A1Via connection structure having multiple via to via connectionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2960US2025277783A1Engineered cannabinoid biomarker(s), in vitro and in vivo testing, and related applicationsAUXERGEN INC·Filed 2024·Application pending·0 cites
- 3058US2024196909A1Bio-control methods for Xylella and Xanthomonas BacteriaYEH TING YU·Filed 2022·Application pending·0 cites
- 3151US12476215B2Power delivery structures and methods of manufacturing thereofTAIWAN SEMICONDUTOR MFG COMPANY LTD·Filed 2022·Granted Nov 18, 2025·0 cites·18 claims
- 3244US10626375B2Disease control of the plant bacterial pathogens causing citrus canker and rice blightAUXERGEN INC·Filed 2015·Granted Apr 21, 2020·0 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →