Inventor · disambiguated record
Tian Zeng
Also filed as: ZENG TIAN
8 granted patents·2 pending applications·2 citations·filing 2018–2022
73Inventor score
Files withWUHAN XINXIN SEMICONDUCTOR MFG8CALIFORNIA INST OF TECHN1ZHUHAI XIANGYI AVIATION TECH COMPANY LTD1
Top patents by PatentIndex Score
10 records- 0170US11573579B1Method, system, and device for planning path for forced landing of aircraft based on image recognitionZHUHAI XIANGYI AVIATION TECH COMPANY LTD·Filed 2022·Granted Feb 7, 2023·1 cites·18 claims
- 0264US11081462B2Method for manufacturing a bonding structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Aug 3, 2021·1 cites·6 claims
- 0356US10867969B2Multi-wafer stacking structure and fabrication method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Granted Dec 15, 2020·0 cites·12 claims
- 0452US11584752B2Method for controlled release using mechanical forceCALIFORNIA INST OF TECHN·Filed 2021·Granted Feb 21, 2023·0 cites·23 claims
- 0550US10700042B2Multi-wafer stacking structure and fabrication method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2018·Granted Jun 30, 2020·0 cites·7 claims
- 0649US11646223B2Metal lead, semiconductor device and methods of fabricating the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Granted May 9, 2023·0 cites·9 claims
- 0742US10784163B2Multi-wafer stacking structure and fabrication method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2018·Granted Sep 22, 2020·0 cites·13 claims
- 0839US10811339B2Semiconductor device and manufacturing method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Oct 20, 2020·0 cites·16 claims
- 0938US2024021559A1First chip and wafer bonding method and chip stacking structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Application pending·0 cites
- 1037US2023402415A1Method for manufacturing semiconductor device, and semiconductor deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →