Inventor · disambiguated record
Tieyu Zheng
Also filed as: ZHENG TIEYU
22 granted patents·4 pending applications·171 citations·filing 2003–2024
95Inventor score
Top patents by PatentIndex Score
26 records- 0190US7429182B1Socket assembly for securing socket bodyINTEL CORP·Filed 2007·Granted Sep 30, 2008·21 cites·11 claims
- 0287US7695288B2Land grid array (LGA) socket with cells and method of fabrication and assemblyINTEL CORP·Filed 2008·Granted Apr 13, 2010·17 cites·19 claims
- 0384US7604486B2Lateral force countering load mechanism for LGA socketsINTEL CORP·Filed 2006·Granted Oct 20, 2009·18 cites·13 claims
- 0482US7479015B2Socket assembly that includes improved contact arrangementINTEL CORP·Filed 2006·Granted Jan 20, 2009·10 cites·10 claims
- 0580US8952532B2Integrated circuit package with spatially varied solder resist opening dimensionZHENG TIEYU·Filed 2013·Granted Feb 10, 2015·7 cites·18 claims
- 0673US6860652B2Package for housing an optoelectronic assemblyINTEL CORP·Filed 2003·Granted Mar 1, 2005·18 cites·30 claims
- 0772US10198333B2Test, validation, and debug architectureTROBOUGH MARK B·Filed 2010·Granted Feb 5, 2019·6 cites·20 claims
- 0872US7255496B2Package for housing an optoelectronic assemblyINTEL CORP·Filed 2005·Granted Aug 14, 2007·5 cites·21 claims
- 0971US8074354B2Method of making a self-balanced dual L-shaped socketZHENG TIEYU·Filed 2008·Granted Dec 13, 2011·4 cites·7 claims
- 1070US7278859B1Extended package substrateINTEL CORP·Filed 2006·Granted Oct 9, 2007·10 cites·24 claims
- 1170US7227248B2Stacked land grid array packageINTEL CORP·Filed 2005·Granted Jun 5, 2007·3 cites·11 claims
- 1269US7419383B2Self-balanced dual L-shaped socketINTEL CORP·Filed 2005·Granted Sep 2, 2008·4 cites·15 claims
- 1369US7176436B2Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic headerINTEL CORP·Filed 2003·Granted Feb 13, 2007·11 cites·11 claims
- 1467US9312237B2Integrated circuit package with spatially varied solder resist opening dimensionINTEL CORP·Filed 2014·Granted Apr 12, 2016·2 cites·6 claims
- 1562US7261572B2Self-balanced land grid array socketINTEL CORP·Filed 2004·Granted Aug 28, 2007·9 cites·22 claims
- 1662US2025374431A1Circuit board assembly for vertical power deliveryMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2024·Application pending·0 cites
- 1761US7223629B2Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic headerINTEL CORP·Filed 2003·Granted May 29, 2007·10 cites·11 claims
- 1853US7524199B2Pick-and-place cap for socket assemblyINTEL CORP·Filed 2007·Granted Apr 28, 2009·4 cites·11 claims
- 1953US7255494B2Low-profile package for housing an optoelectronic assemblyINTEL CORP·Filed 2003·Granted Aug 14, 2007·5 cites·25 claims
- 2053US6992373B2Stacked land grid array packageINTEL CORP·Filed 2004·Granted Jan 31, 2006·3 cites·10 claims
- 2149US7201521B2Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic headerINTEL CORP·Filed 2003·Granted Apr 10, 2007·2 cites·21 claims
- 2248US7497696B2Socket for land grid array packageINTEL CORP·Filed 2007·Granted Mar 3, 2009·2 cites·13 claims
- 2346US2005129372A1Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic headerFiled 2003·Application pending·0 cites
- 2445US2014168909A1Gapped attachment structuresZHENG TIEYU·Filed 2012·Application pending·0 cites
- 2541US7677902B2Extended package substrateINTEL CORP·Filed 2007·Granted Mar 16, 2010·0 cites·26 claims
- 2638US2005207458A1Optoelectronic module with integrated coolerZHENG TIEYU·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →