Inventor · disambiguated record
Ting Zhong
Also filed as: ZHONG TING
13 granted patents·4 pending applications·147 citations·filing 2003–2017
90Inventor score
Top patents by PatentIndex Score
17 records- 0197US7391112B2Capping copper bumpsINTEL CORP·Filed 2005·Granted Jun 24, 2008·91 cites·6 claims
- 0282US9010618B2Magnetic attachment structureINTEL CORP·Filed 2013·Granted Apr 21, 2015·5 cites·6 claims
- 0380US7223695B2Methods to deposit metal alloy barrier layersINTEL CORP·Filed 2004·Granted May 29, 2007·18 cites·43 claims
- 0477US9523713B2Interconnects including liquid metalINTEL CORP·Filed 2013·Granted Dec 20, 2016·5 cites·16 claims
- 0577US8434668B2Magnetic attachment structureALEKSOV ALEKSANDAR·Filed 2010·Granted May 7, 2013·4 cites·16 claims
- 0676US7087104B2Preparation of electroless deposition solutionsINTEL CORP·Filed 2003·Granted Aug 8, 2006·16 cites·23 claims
- 0769US9731369B2Interconnect alloy material and methodsINTEL CORP·Filed 2013·Granted Aug 15, 2017·1 cites·14 claims
- 0867US10099307B2Interconnect alloy material and methodsINTEL CORP·Filed 2017·Granted Oct 16, 2018·0 cites·8 claims
- 0966US7919859B2Copper die bumps with electromigration cap and plated solderINTEL CORP·Filed 2007·Granted Apr 5, 2011·4 cites·15 claims
- 1062US7416980B2Forming a barrier layer in interconnect joints and structures formed therebyINTEL CORP·Filed 2005·Granted Aug 26, 2008·2 cites·12 claims
- 1160US9835648B2Liquid metal interconnectsBASKARAN RAJASHREE·Filed 2011·Granted Dec 5, 2017·1 cites·13 claims
- 1253US9860988B2Solder contacts for socket assembliesINTEL CORP·Filed 2014·Granted Jan 2, 2018·0 cites·24 claims
- 1352US2008202922A1Hybrid electro-deposition of soft magnetic cobalt alloy filmsZHONG TING·Filed 2007·Application pending·0 cites
- 1451US10321573B2Solder contacts for socket assembliesINTEL CORP·Filed 2017·Granted Jun 11, 2019·0 cites·22 claims
- 1547US2007123025A1Forming a barrier layer in joint structuresZHONG TING·Filed 2007·Application pending·0 cites
- 1640US2008045013A1Iridium encased metal interconnects for integrated circuit applicationsLAVOIE ADRIEN R·Filed 2006·Application pending·0 cites
- 1737US2007045833A1Copper bump barrier cap to reduce electrical resistanceZHONG TING·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →