Inventor · disambiguated record
Tolga Acikalin
Also filed as: ACIKALIN TOLGA
11 granted patents·25 pending applications·21 citations·filing 2009–2024
83Inventor score
Top patents by PatentIndex Score
36 records- 0187US12401450B2Wireless device and methods for dynamic channel codingINTEL CORP·Filed 2023·Granted Aug 26, 2025·1 cites·20 claims
- 0285US9448278B2Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming sameINTEL CORP·Filed 2015·Granted Sep 20, 2016·5 cites·18 claims
- 0383US9347987B2Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming sameSCHROEDER CHRISTOPHER R·Filed 2009·Granted May 24, 2016·13 cites·20 claims
- 0481US12490067B2Systems and methods for autonomous vehicle communicationAPPLE INC·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 0573US12082086B2Systems and methods for autonomous vehicle communicationAPPLE INC·Filed 2019·Granted Sep 3, 2024·1 cites·20 claims
- 0664US9927620B2System for flat-top intensity laser sheet beam generationINTEL CORP·Filed 2015·Granted Mar 27, 2018·1 cites·17 claims
- 0762US2025112357A1Semiconductor package with rfic and antennaINTEL CORP·Filed 2024·Application pending·0 cites
- 0860US2025309522A1Antenna structures in glass coresINTEL CORP·Filed 2024·Application pending·0 cites
- 0959US2025219301A1Wideband antennas for wireless broadcast channels employed between chiplet, die, package, or printed-circuit boardsINTEL CORP·Filed 2023·Application pending·0 cites
- 1059US2025298202A1Technologies for bridge dies for optical interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 1158US12506269B2Antenna assembly for integrated circuit packageINTEL CORP·Filed 2021·Granted Dec 23, 2025·0 cites·25 claims
- 1258US12327814B2Electronic substrate core having an embedded laser stop to control depth of an ultra-deep cavityINTEL CORP·Filed 2021·Granted Jun 10, 2025·0 cites·20 claims
- 1357US12366713B2Heat dissipation structures for optical communication devicesINTEL CORP·Filed 2021·Granted Jul 22, 2025·0 cites·25 claims
- 1457US2024421465A1Wireless interconnects in integrated circuit package substrates with glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1557US2025218963A1Die and conductive vias embedded in a substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 1657US2025218915A1Pedestal structure for passive circuit component structureINTEL CORP·Filed 2023·Application pending·0 cites
- 1757US2024421062A1Pluggable interconnects using glass cores of integrated circuit package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1857US2025285926A1Core joining for embedded die within package substratesINTEL CORP·Filed 2024·Application pending·0 cites
- 1956US2025218952A1Spacer for embedded component in coreINTEL CORP·Filed 2023·Application pending·0 cites
- 2056US2025218983A1Microelectronic structures including embedded integrated capacitor in multilayer coreINTEL CORP·Filed 2023·Application pending·0 cites
- 2156US2025218961A1Methods and apparatus to facilitate semiconductor device alignment in an integrated circuit packageINTEL CORP·Filed 2023·Application pending·0 cites
- 2255US2025201787A1Apparatus and methods for embedding deep trench capacitor (dtc) components in a substrateINTEL CORP·Filed 2023·Application pending·0 cites
- 2354US2024176167A1Integrated optical phase change materials for reconfigurable optics in glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 2454US2025219040A1Technologies for Components Embedded in a Substrate CoreINTEL CORP·Filed 2023·Application pending·0 cites
- 2552US2025192418A1Chip-to-chip waveguide and contactless chip-to-chip communicationINTEL CORP·Filed 2022·Application pending·0 cites
- 2651US2023411369A1Photonics packaging with high-density routingINTEL CORP·Filed 2022·Application pending·0 cites
- 2750US12009321B2Package system and packageINTEL CORP·Filed 2020·Granted Jun 11, 2024·0 cites·24 claims
- 2850US2024106126A1Contactless multi-drop and broadcast bidirectional communication systemINTEL CORP·Filed 2023·Application pending·0 cites
- 2950US2024222859A1Apparatus and devices to reduce electromagnetic interference for short-range wireless interconnectionsINTEL CORP·Filed 2022·Application pending·0 cites
- 3048US2022413236A1Photonic integrated circuit cooling with a thermal dieINTEL CORP·Filed 2021·Application pending·0 cites
- 3148US2024113438A1Package integrated multiband and polarization diversified mode reconfigurable antenna system for robust wireless chip to chip communicationINTEL CORP·Filed 2022·Application pending·0 cites
- 3248US2023207405A1Ultra low loss routing between glass coresINTEL CORP·Filed 2021·Application pending·0 cites
- 3347US10670523B2Particulate matter measurement using light sheet generation and scattering analysisINTEL CORP·Filed 2016·Granted Jun 2, 2020·0 cites·25 claims
- 3447US2023420396A1Device-to-device communication system, packages, and package systemINTEL CORP·Filed 2020·Application pending·0 cites
- 3547US2024021522A1Wireless chip-to-chip high-speed data transportINTEL CORP·Filed 2020·Application pending·0 cites
- 3644US2022415742A1Microelectronic assemblies having dies with backside back-end-of-line heater tracesINTEL CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →