Inventor · disambiguated record
Tomoyuki Akahoshi
Also filed as: AKAHOSHI TOMOYUKI
12 granted patents·11 pending applications·75 citations·filing 1999–2023
88Inventor score
Top patents by PatentIndex Score
23 records- 0189US6341836B1Water-repellent coating and method for forming same on the surface of liquid jetFUJITSU LTD·Filed 2000·Granted Jan 29, 2002·37 cites·10 claims
- 0281US9491860B2Wiring board and electronic apparatusFUJITSU LTD·Filed 2014·Granted Nov 8, 2016·6 cites·9 claims
- 0367US7565044B2Optical module method of manufacturing the sameFUJITSU LTD·Filed 2008·Granted Jul 21, 2009·4 cites·18 claims
- 0465US7522788B2Optical module and method of manufacturing the sameFUJITSU LTD·Filed 2008·Granted Apr 21, 2009·3 cites·20 claims
- 0564US10896871B2Circuit board, method for manufacturing circuit board, and electronic deviceFUJITSU LTD·Filed 2018·Granted Jan 19, 2021·1 cites·10 claims
- 0663US7097366B2Method for production of optical module and optical moduleFUJITSU LTD·Filed 2004·Granted Aug 29, 2006·8 cites·23 claims
- 0759US9179539B2Wiring board and design method for wiring boardFUJITSU LTD·Filed 2013·Granted Nov 3, 2015·1 cites·11 claims
- 0856US2025164719A1Semiconductor moduleKYOCERA CORP·Filed 2023·Application pending·0 cites
- 0955US10701808B2Capacitor built-in multilayer wiring substrate and manufacturing method thereofFUJITSU LTD·Filed 2019·Granted Jun 30, 2020·0 cites·4 claims
- 1055US6382780B1Inkjet head formed of divided pressure-chamber plate, method for manufacturing the same, and recording device having the inkjet headFUJITSU LTD·Filed 1999·Granted May 7, 2002·15 cites·19 claims
- 1154US2024310591A1Optical module and optical communication deviceKYOCERA CORP·Filed 2022·Application pending·0 cites
- 1254US2025052959A1Optical module and optical communication deviceKYOCERA CORP·Filed 2022·Application pending·0 cites
- 1353US10362677B2Capacitor built-in multilayer wiring substrate and manufacturing method thereofFUJITSU LTD·Filed 2018·Granted Jul 23, 2019·0 cites·10 claims
- 1451US2015189751A1Wiring board, method for fabricating the same, and electronic apparatusFUJITSU LTD·Filed 2014·Application pending·0 cites
- 1548US2013341765A1Semiconductor device and method for manufacturing semiconductor deviceFUJITSU LTD·Filed 2013·Application pending·0 cites
- 1644US11317520B2Circuit board, method of manufacturing circuit board, and electronic deviceFUJITSU LTD·Filed 2018·Granted Apr 26, 2022·0 cites·8 claims
- 1744US2019306982A1Circuit board and method of manufacturing circuit boardFUJITSU LTD·Filed 2019·Application pending·0 cites
- 1843US2015214104A1Semiconductor device and method for manufacturing semiconductor deviceFUJITSU LTD·Filed 2015·Application pending·0 cites
- 1942US2020245463A1Capacitor-embedded substrate and electronic apparatusFUJITSU LTD·Filed 2020·Application pending·0 cites
- 2041US2010244274A1Wiring boardFUJITSU LTD·Filed 2010·Application pending·0 cites
- 2141US2019215963A1Circuit board, method of manufacturing circuit board, and electronic deviceFUJITSU LTD·Filed 2019·Application pending·0 cites
- 2240US2019306981A1Circuit substrate and method for fabricating circuit substrateFUJITSU LTD·Filed 2019·Application pending·0 cites
- 2337US10396020B2Method of manufacturing boardFUJITSU LTD·Filed 2018·Granted Aug 27, 2019·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →