Inventor · disambiguated record
Toshitaka Akahoshi
Also filed as: AKAHOSHI TOSHITAKA
6 granted patents·5 pending applications·73 citations·filing 2004–2016
82Inventor score
Technology areasH10W
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD5PANASONIC CORP3AKAHOSHI TOSHITAKA1AOKURA ISAMU1PANASONIC IP MAN CO LTD1
Top patents by PatentIndex Score
11 records- 0192US7521288B2Stacked chip semiconductor device and method for manufacturing the samePANASONIC CORP·Filed 2007·Granted Apr 21, 2009·29 cites·6 claims
- 0282US9502455B2Optical apparatus having resin encased stacked optical and semiconductor devicesPANASONIC CORP·Filed 2015·Granted Nov 22, 2016·5 cites·12 claims
- 0374US7298045B2Stacked semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 20, 2007·23 cites·9 claims
- 0472US10090350B2Light receiving devicePANASONIC IP MAN CO LTD·Filed 2016·Granted Oct 2, 2018·2 cites·8 claims
- 0568US7239021B2Stacked chip semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 3, 2007·14 cites·2 claims
- 0644US2010044880A1Semiconductor device and semiconductor moduleAOKURA ISAMU·Filed 2009·Application pending·0 cites
- 0743US2009091039A1Semiconductor device, method of manufacturing the same, and semiconductor substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2008·Application pending·0 cites
- 0843US2010127382A1Semiconductor deviceAKAHOSHI TOSHITAKA·Filed 2009·Application pending·0 cites
- 0938US2006220207A1Stacked semiconductor packageMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 1038US2006202793A1Image sensor device and manufacturing method of the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 1130US10109660B2Laminated semiconductor devicePANASONIC CORP·Filed 2015·Granted Oct 23, 2018·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →