Inventor · disambiguated record
Toshihiko Akiba
Also filed as: AKIBA TOSHIHIKO
20 granted patents·5 pending applications·95 citations·filing 2007–2023
93Inventor score
Top patents by PatentIndex Score
25 records- 0192US10566255B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2019·Granted Feb 18, 2020·2 cites·11 claims
- 0292US8101433B2Semiconductor device and manufacturing method of the sameAKIBA TOSHIHIKO·Filed 2009·Granted Jan 24, 2012·15 cites·13 claims
- 0391US10163791B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Dec 25, 2018·8 cites·14 claims
- 0491US8298963B2Semiconductor device and manufacturing method of the sameAKIBA TOSHIHIKO·Filed 2010·Granted Oct 30, 2012·18 cites·16 claims
- 0591US7847413B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2007·Granted Dec 7, 2010·24 cites·6 claims
- 0690US8791574B2Semiconductor device and manufacturing method of the sameAKIBA TOSHIHIKO·Filed 2012·Granted Jul 29, 2014·14 cites·4 claims
- 0787US9646901B2Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark areaRENESAS ELECTRONICS CORP·Filed 2016·Granted May 9, 2017·3 cites·16 claims
- 0886US9293436B2Bonding wire to bonding padRENESAS ELECTRONICS CORP·Filed 2015·Granted Mar 22, 2016·5 cites·9 claims
- 0978US8912540B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 16, 2014·2 cites·15 claims
- 1077US9911673B2Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark areaRENESAS ELECTRONICS CORP·Filed 2017·Granted Mar 6, 2018·1 cites·16 claims
- 1173US2023411368A1Semiconductor device including a circuit for transmitting a signalRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1271US11158617B2Semiconductor device including a circuit for transmitting a signalRENESAS ELECTRONICS CORP·Filed 2019·Granted Oct 26, 2021·1 cites·15 claims
- 1368US11784173B2Semiconductor device including a circuit for transmitting a signalRENESAS ELECTRONICS CORP·Filed 2021·Granted Oct 10, 2023·0 cites·16 claims
- 1464US10128129B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2017·Granted Nov 13, 2018·1 cites·9 claims
- 1564US2019057913A1Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Application pending·0 cites
- 1663US10134648B2Manufacturing method of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Nov 20, 2018·0 cites·13 claims
- 1762US11171547B2Electric actuator having rotation sensor on outer surface of caseNIDEC TOSOK CORP·Filed 2019·Granted Nov 9, 2021·0 cites·8 claims
- 1861US9165845B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Oct 20, 2015·0 cites·8 claims
- 1960US9711377B2Method of manufacturing semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2015·Granted Jul 18, 2017·1 cites·9 claims
- 2058US2016035636A1Manufacturing Method of Semiconductor DeviceRENESAS ELECTRONICS CORP·Filed 2015·Application pending·0 cites
- 2155US8415199B2Manufacturing method of semiconductor deviceAKIBA TOSHIHIKO·Filed 2011·Granted Apr 9, 2013·0 cites·2 claims
- 2250US12148680B2Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2021·Granted Nov 19, 2024·0 cites·11 claims
- 2345US2016197050A1Manufacturing method of semiconductor device and semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 2439US11063009B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2018·Granted Jul 13, 2021·0 cites·18 claims
- 2536US2010301459A1Method for manufacturing a semiconductor device and a semiconductor deviceRENESAS TECH CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →