Inventor · disambiguated record
Tomoaki Asai
Also filed as: ASAI TOMOAKI
7 granted patents·6 pending applications·7 citations·filing 2010–2013
73Inventor score
Top patents by PatentIndex Score
13 records- 0177US8686823B2Electronic unitASANO HIROAKI·Filed 2012·Granted Apr 1, 2014·5 cites·8 claims
- 0261US9693456B2Substrate and metal layer manufacturing methodTOYOTA JIDOSHOKKI KK·Filed 2013·Granted Jun 27, 2017·1 cites·4 claims
- 0354US8917495B2Circuit board production method and circuit boardSHIMADU HITOSHI·Filed 2010·Granted Dec 23, 2014·1 cites·9 claims
- 0447US2015282313A1Wiring board and wiring board production methodTOYOTA JIDOSHOKKI KK·Filed 2013·Application pending·0 cites
- 0546US2015235755A1Planar coil and manufacturing method for transformer and planar coilTOYOTA JIDOSHOKKI KK·Filed 2013·Application pending·0 cites
- 0643US2015289375A1Module for facilitating positioning of electronic componentsTOYOTA JIDOSHOKKI KK·Filed 2013·Application pending·0 cites
- 0742US8963672B2Wiring boardASANO HIROAKI·Filed 2012·Granted Feb 24, 2015·0 cites·8 claims
- 0842US2014226296A1Multi-layer wiring board and method for producing multi-layer wiring boardTOYOTA JIDOSHOKKI KK·Filed 2012·Application pending·0 cites
- 0940US9655240B2SubstrateTOYOTA JIDOSHOKKI KK·Filed 2013·Granted May 16, 2017·0 cites·4 claims
- 1040US2014251659A1Circuit board, and manufacturing method for circuit boardASANO HIROAKI·Filed 2012·Application pending·0 cites
- 1137US9332638B2Wiring board and method for manufacturing wiring boardOZAKI KIMINORI·Filed 2012·Granted May 3, 2016·0 cites·5 claims
- 1235US2014027170A1Wiring substrateSHIMADU HITOSHI·Filed 2012·Application pending·0 cites
- 1326US9084371B2Wiring substrate and manufacturing method for wiring substrateSHIMADU HITOSHI·Filed 2010·Granted Jul 14, 2015·0 cites·13 claims
Join the waitlist — get patent alerts
Get an alert when Tomoaki Asai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →