Inventor · disambiguated record
Tomohiro Ayugase
Also filed as: AYUGASE TOMOHIRO
0 granted patents·5 pending applications·0 citations·filing 2021–2023
Files withRESONAC CORP5
Top patents by PatentIndex Score
5 records- 0164US2025224672A1Photosensitive resin film, printed wiring board, semiconductor package, and method for manufacturing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0252US2024393686A1Photosensitive resin composition, photosensitive resin film, multilayered printed wiring board, semiconductor package, and method for producing multilayered printed wiring boardRESONAC CORP·Filed 2021·Application pending·0 cites
- 0351US2025306465A1Photosensitive multilayer resin film, printed wiring board, semiconductor package, and method for producing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0451US2025226236A1Photosensitive resin film, printed wiring board, semiconductor package, and method for producing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 0549US2025227853A1Photosensitive multilayer resin film, printed wiring board, semiconductor package, and method for producing printed wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →