Inventor · disambiguated record
Tony Chen
Also filed as: CHEN TONY · CHEN TONY WEI
6 granted patents·1 pending application·23 citations·filing 1997–2023
74Inventor score
Files withNEW YORK SOC RUPTURED & CRIPPLED MAINTAINING HOSPITAL FOR SPECIAL SURGERY3CHARTERED SEMICONDUCTOR MFG1MAHER SUZANNE A1NEW YORK SOC FOR THE RELIEF OF THE RUPTURED AND CRIPPLED MAINTAINING THE HOSPITAL FOR SPECIAL S1NEW YORK SOC FOR THE RELIEF OF THE RUPTURED AND CRIPPLED MAINTAINING THE HOSPITAL FOR SPECIAL SURGER1
Top patents by PatentIndex Score
7 records- 0179US9545310B2Multi-component non-biodegradable implant, a method of making and a method of implantationNEW YORK SOC RUPTURED & CRIPPLED MAINTAINING HOSPITAL FOR SPECIAL SURGERY·Filed 2014·Granted Jan 17, 2017·12 cites·58 claims
- 0258US12311077B2Method of making, manufacturing or producing orthopedic soft tissueNEW YORK SOC FOR THE RELIEF OF THE RUPTURED AND CRIPPLED MAINTAINING THE HOSPITAL FOR SPECIAL SURGER·Filed 2018·Granted May 27, 2025·0 cites·17 claims
- 0356US11040124B2Method of and a mold for the manufacture, making and/or production of a multi-component implant, device, construct or materialNEW YORK SOC RUPTURED & CRIPPLED MAINTAINING HOSPITAL FOR SPECIAL SURGERY·Filed 2018·Granted Jun 22, 2021·0 cites·12 claims
- 0456US2025331769A1Apparatus and Method of Mechanical Phenotyping of KneesNEW YORK SOC FOR THE RELIEF OF THE RUPTURED AND CRIPPLED MAINTAINING THE HOSPITAL FOR SPECIAL S·Filed 2023·Application pending·0 cites
- 0549US10583224B2Multi-component non-biodegradable implant, a method of making and a method of implantationNEW YORK SOC RUPTURED & CRIPPLED MAINTAINING HOSPITAL FOR SPECIAL SURGERY·Filed 2016·Granted Mar 10, 2020·0 cites·11 claims
- 0648US5861643ASelf-aligned JFETCHARTERED SEMICONDUCTOR MFG·Filed 1997·Granted Jan 19, 1999·11 cites·20 claims
- 0738US8557270B2Interconnected porous non-degradable poly(vinyl) alcohol implant and method of manufactureMAHER SUZANNE A·Filed 2012·Granted Oct 15, 2013·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →