Inventor · disambiguated record
Tomoya Egawa
Also filed as: EGAWA TOMOYA
3 granted patents·2 pending applications·1 citations·filing 2011–2020
46Inventor score
Top patents by PatentIndex Score
5 records- 0153US12152169B2Adhesive conductive pasteDAICEL CORP·Filed 2020·Granted Nov 26, 2024·0 cites·8 claims
- 0253US9685597B2Curable composition for sealing optical semiconductorDAICEL CORP·Filed 2014·Granted Jun 20, 2017·1 cites·20 claims
- 0340US2020347180A1Resin composition for forming hard coating layerDAICEL CORP·Filed 2019·Application pending·0 cites
- 0439US2020199372A1Resin composition for forming hard coating layerDAICEL CORP·Filed 2018·Application pending·0 cites
- 0528US8791221B2Addition-curable metallosiloxane compoundEGAWA TOMOYA·Filed 2011·Granted Jul 29, 2014·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →