Inventor · disambiguated record
Toshio Enami
Also filed as: ENAMI TOSHIO
5 granted patents·2 pending applications·46 citations·filing 2001–2022
78Inventor score
Top patents by PatentIndex Score
7 records- 0178US7645514B2Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined bodySEKISUI CHEMICAL CO LTD·Filed 2003·Granted Jan 12, 2010·16 cites·28 claims
- 0274US8119323B2Process for producing patterned film and photosensitive resin compositionFUKUI HIROJI·Filed 2006·Granted Feb 21, 2012·4 cites·8 claims
- 0369US6635962B2Chip on chip semiconductor deviceROHM CO LTD·Filed 2001·Granted Oct 21, 2003·16 cites·8 claims
- 0460US7591921B2Heat-decaying materials, transfer sheet using the same, and patterning methodSEKISUI CHEMICAL CO LTD·Filed 2003·Granted Sep 22, 2009·10 cites·33 claims
- 0560US2024376252A1Curable resin composition, adhesive for optical light-receiving and emitting module, sealing agent for optical light-receiving and emitting module, and member for optical light-receiving and emitting moduleSEKISUI CHEMICAL CO LTD·Filed 2022·Application pending·0 cites
- 0643US2024088570A1Structure and construction materialSEKISUI CHEMICAL CO LTD·Filed 2022·Application pending·0 cites
- 0736US10131826B2Adhesive film for semiconductor chip with through electrodeSEKISUI CHEMICAL CO LTD·Filed 2015·Granted Nov 20, 2018·0 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →