Inventor · disambiguated record
Toshiyuki Fukuda
Also filed as: FUKUDA TOSHIYUKI
83 granted patents·27 pending applications·1,471 citations·filing 1985–2025
99Inventor score
Files withPANASONIC CORP41MATSUSHITA ELECTRIC INDUSTRIAL CO LTD31KANZAKI KOKYUKOKI MFG CO LTD8FURUYASHIKI JUNYA4MINAMIO MASANORI4
Top patents by PatentIndex Score
110 records- 0198US7365416B2Multi-level semiconductor module and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Apr 29, 2008·144 cites·13 claims
- 0297US7595222B2Semiconductor device and manufacturing method thereofPANASONIC CORP·Filed 2005·Granted Sep 29, 2009·65 cites·6 claims
- 0397US7495319B2Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the samePANASONIC CORP·Filed 2005·Granted Feb 24, 2009·59 cites·11 claims
- 0495US8390117B2Semiconductor device and method of manufacturing the sameSHIMIZU YOSHIAKI·Filed 2008·Granted Mar 5, 2013·40 cites·19 claims
- 0595US6130115APlastic encapsulated semiconductor device and method of manufacturing the sameMATSUSHITA ELECTRONICS CORP·Filed 1999·Granted Oct 10, 2000·210 cites·4 claims
- 0695US5942794APlastic encapsulated semiconductor device and method of manufacturing the sameMATSUSHITA ELECTRONICS CORP·Filed 1997·Granted Aug 24, 1999·230 cites·13 claims
- 0793US7939933B2Semiconductor devicePANASONIC CORP·Filed 2009·Granted May 10, 2011·17 cites·2 claims
- 0893US7405104B2Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Jul 29, 2008·26 cites·10 claims
- 0992US8013350B2Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical devicePANASONIC CORP·Filed 2008·Granted Sep 6, 2011·28 cites·15 claims
- 1092US7667313B2Stacked semiconductor modulePANASONIC CORP·Filed 2006·Granted Feb 23, 2010·19 cites·9 claims
- 1192US6897428B2Solid-state imaging device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted May 24, 2005·70 cites·13 claims
- 1291US7589404B2Semiconductor devicePANASONIC CORP·Filed 2008·Granted Sep 15, 2009·11 cites·4 claims
- 1390US8178955B2Semiconductor deviceITOU KENICHI·Filed 2011·Granted May 15, 2012·11 cites·20 claims
- 1490US7822090B2Semiconductor devicePANASONIC CORP·Filed 2008·Granted Oct 26, 2010·12 cites·17 claims
- 1587US7443028B2Imaging module and method for forming the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Oct 28, 2008·16 cites·13 claims
- 1686US7586183B2Multilevel semiconductor module and method for fabricating the samePANASONIC CORP·Filed 2006·Granted Sep 8, 2009·14 cites·21 claims
- 1786US7482701B2Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor devicePANASONIC CORP·Filed 2007·Granted Jan 27, 2009·15 cites·16 claims
- 1886US7397113B2Semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Jul 8, 2008·7 cites·9 claims
- 1985US8159061B2Stacked semiconductor moduleKAWABATA TAKESHI·Filed 2010·Granted Apr 17, 2012·6 cites·27 claims
- 2084US9360204B2Light-emitting devicePANASONIC CORP·Filed 2014·Granted Jun 7, 2016·7 cites·11 claims
- 2184US7582944B2Optical apparatus and optical module using the samePANASONIC CORP·Filed 2007·Granted Sep 1, 2009·13 cites·19 claims
- 2284US7166908B2Optical deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jan 23, 2007·12 cites·4 claims
- 2384US6680220B2Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor packageMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Jan 20, 2004·32 cites·6 claims
- 2483US7595540B2Semiconductor device and method of manufacturing the samePANASONIC CORP·Filed 2006·Granted Sep 29, 2009·15 cites·23 claims
- 2583US6984880B2Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jan 10, 2006·34 cites·4 claims
- 2683US6841854B2Semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jan 11, 2005·19 cites·10 claims
- 2782US8841772B2Semiconductor device and method of manufacturing the samePANASONIC CORP·Filed 2013·Granted Sep 23, 2014·4 cites·5 claims
- 2882US7834926B2Semiconductor image sensing element and fabrication method therefor, and semiconductor image sensing device and fabrication method thereforPANASONIC CORP·Filed 2006·Granted Nov 16, 2010·11 cites·20 claims
- 2981US7504735B2Manufacturing method of resin-molding type semiconductor device, and wiring board thereforPANASONIC CORP·Filed 2007·Granted Mar 17, 2009·9 cites·16 claims
- 3081US7049684B2Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted May 23, 2006·25 cites·14 claims
- 3180US7993980B2Lead frame, electronic component including the lead frame, and manufacturing method thereofPANASONIC CORP·Filed 2008·Granted Aug 9, 2011·8 cites·17 claims
- 3279US7728429B2Semiconductor device having recessed connector portionsPANASONIC CORP·Filed 2007·Granted Jun 1, 2010·9 cites·24 claims
- 3379US7327021B2Multi-level semiconductor moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Feb 5, 2008·7 cites·3 claims
- 3477US7790270B2Wiring board and semiconductor devicePANASONIIC CORP·Filed 2007·Granted Sep 7, 2010·9 cites·12 claims
- 3577US4644758ARefrigerated display cabinetSANDEN CORP·Filed 1985·Granted Feb 24, 1987·47 cites·8 claims
- 3676US11994170B2Differential gearKANZAKI KOKYUKOKI MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·1 claims
- 3776US9545026B2Electronic component module and an assembly including the samePANASONIC CORP·Filed 2015·Granted Jan 10, 2017·3 cites·20 claims
- 3875US7170189B2Semiconductor wafer and testing method thereforMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jan 30, 2007·7 cites·18 claims
- 3974US7547955B2Semiconductor imaging device and method for manufacturing the samePANASONIC CORP·Filed 2007·Granted Jun 16, 2009·6 cites·7 claims
- 4074US7298045B2Stacked semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 20, 2007·23 cites·9 claims
- 4174US6720207B2Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Apr 13, 2004·21 cites·28 claims
- 4273US10830291B2TransaxleKANZAKI KOKYUKOKI MFG CO LTD·Filed 2018·Granted Nov 10, 2020·1 cites·3 claims
- 4373US7816777B2Semiconductor-element mounting substrate, semiconductor device, and electronic equipmentPANASONIC CORP·Filed 2006·Granted Oct 19, 2010·7 cites·19 claims
- 4473US7087455B2Semiconductor device and manufacturing method for the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 8, 2006·17 cites·6 claims
- 4573US6680524B2Semiconductor device and method for fabricating the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jan 20, 2004·20 cites·5 claims
- 4672US8018526B2Optical device module, fabrication method thereof, optical device unit and fabrication method thereofPANASONIC CORP·Filed 2007·Granted Sep 13, 2011·3 cites·20 claims
- 4772US7563644B2Optical device and method for fabricating the samePANASONIC CORP·Filed 2008·Granted Jul 21, 2009·3 cites·4 claims
- 4872US7132733B2Semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Nov 7, 2006·9 cites·16 claims
- 4971US9551383B2TransaxleKANZAKI KOKYUKOKI MFG CO LTD·Filed 2015·Granted Jan 24, 2017·2 cites·2 claims
- 5071US7923798B2Optical device and method for fabricating the same, camera module using optical device, and electronic equipment mounting camera modulePANASONIC CORP·Filed 2008·Granted Apr 12, 2011·5 cites·10 claims
Showing the top 50 of 110 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →