Inventor · disambiguated record
Toshiyuki Hata
Also filed as: HATA TOSHIYUKI
64 granted patents·23 pending applications·1,130 citations·filing 1992–2025
99Inventor score
Files withRENESAS ELECTRONICS CORP27RENESAS TECH CORP23HITACHI LTD7YAMAHA CORP6MATSUSHITA ELECTRIC INDUSTRIAL CO LTD5
Top patents by PatentIndex Score
87 records- 0198US7408251B2Semiconductor packaging device comprising a semiconductor chip including a MOSFETRENESAS TECH CORP·Filed 2005·Granted Aug 5, 2008·93 cites·16 claims
- 0298US6774466B1Semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted Aug 10, 2004·162 cites·2 claims
- 0396US6310756B1CapacitorMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Oct 30, 2001·213 cites·44 claims
- 0494US7985991B2MOSFET packageRENESAS ELECTRONICS CORP·Filed 2008·Granted Jul 26, 2011·16 cites·30 claims
- 0594US6479888B1Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2000·Granted Nov 12, 2002·77 cites·5 claims
- 0692US8222651B2Semiconductor deviceKANAZAWA TAKAMITSU·Filed 2010·Granted Jul 17, 2012·18 cites·13 claims
- 0792US7586180B2Semiconductor packaging device comprising a semiconductor chip including a MOSFETRENESAS TECH CORP·Filed 2008·Granted Sep 8, 2009·21 cites·8 claims
- 0892US6992386B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted Jan 31, 2006·58 cites·6 claims
- 0992US6992385B2Semiconductor device, a method of manufacturing the same and an electronic deviceRENESAS TECH CORP·Filed 2004·Granted Jan 31, 2006·47 cites·22 claims
- 1091US9824996B2Semiconductor device having low on resistanceRENESAS ELECTRONICS CORP·Filed 2015·Granted Nov 21, 2017·5 cites·16 claims
- 1191US8183607B2Semiconductor deviceKAJIWARA RYOICHI·Filed 2011·Granted May 22, 2012·8 cites·4 claims
- 1290US7400002B2MOSFET packageRENESAS TECH CORP·Filed 2006·Granted Jul 15, 2008·11 cites·20 claims
- 1390US7332757B2MOSFET packageRENESAS TECH CORP·Filed 2006·Granted Feb 19, 2008·11 cites·8 claims
- 1489US7342267B2MOSFET packageRENESAS TECH CORP·Filed 2006·Granted Mar 11, 2008·10 cites·48 claims
- 1588US7173333B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Feb 6, 2007·40 cites·20 claims
- 1687US7812464B2Semiconductor device and a method of manufacturing for high output MOSFETRENESAS ELECTRONICS CORP·Filed 2008·Granted Oct 12, 2010·10 cites·7 claims
- 1787US7800215B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2009·Granted Sep 21, 2010·9 cites·16 claims
- 1887US7432594B2Semiconductor chip, electrically connections thereforRENESAS TECH CORP·Filed 2005·Granted Oct 7, 2008·17 cites·18 claims
- 1987US7319493B2Apparatus and program for setting video processing parametersYAMAHA CORP·Filed 2004·Granted Jan 15, 2008·33 cites·30 claims
- 2086US8455986B2Mosfet packageKAJIWARA RYOICHI·Filed 2012·Granted Jun 4, 2013·4 cites·12 claims
- 2185US7541672B2Semiconductor deviceRENESAS TECH CORP·Filed 2006·Granted Jun 2, 2009·8 cites·5 claims
- 2284US8138600B2Semiconductor device and method of manufacturing the sameMUTO AKIRA·Filed 2007·Granted Mar 20, 2012·18 cites·29 claims
- 2384US6882047B2Semiconductor package including a plurality of semiconductor chips thereinRENESAS TECH CORP·Filed 2002·Granted Apr 19, 2005·38 cites·12 claims
- 2482US8816411B2Mosfet packageRENESAS ELECTRONICS CORP·Filed 2013·Granted Aug 26, 2014·3 cites·8 claims
- 2581US8811626B2Recording/reproducing apparatusHATA TOSHIYUKI·Filed 2009·Granted Aug 19, 2014·5 cites·4 claims
- 2679US7955902B2Manufacturing method of semiconductor device with surface mounting terminalsRENESAS ELECTRONICS CORP·Filed 2010·Granted Jun 7, 2011·4 cites·10 claims
- 2778US8304890B2Semiconductor deviceSATOU YUKIHIRO·Filed 2010·Granted Nov 6, 2012·3 cites·53 claims
- 2878US7394146B2MOSFET packageRENESAS TEHCNOLOGY CORP·Filed 2006·Granted Jul 1, 2008·5 cites·30 claims
- 2978US5808359ASemiconductor device having a heat sink with bumpers for protecting outer leadsHITACHI LTD·Filed 1995·Granted Sep 15, 1998·40 cites·6 claims
- 3077US8698289B2Semiconductor device, a method of manufacturing the same and an electronic deviceSATOU YUKIHIRO·Filed 2011·Granted Apr 15, 2014·3 cites·12 claims
- 3177US7667307B2Semiconductor deviceRENESAS TECH CORP·Filed 2008·Granted Feb 23, 2010·5 cites·2 claims
- 3274US7084491B2Semiconductor deviceRENESAS TECH CORP·Filed 2004·Granted Aug 1, 2006·12 cites·16 claims
- 3374US6812554B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2002·Granted Nov 2, 2004·14 cites·5 claims
- 3472US8629467B2Semiconductor deviceKANAZAWA TAKAMITSU·Filed 2012·Granted Jan 14, 2014·3 cites·22 claims
- 3572US8022518B2Semiconductor device having a sealing body and partially exposed conductorsRENESAS ELECTRONICS CORP·Filed 2010·Granted Sep 20, 2011·2 cites·12 claims
- 3671US6492739B2Semiconductor device having bumper portions integral with a heat sinkHITACHI LTD·Filed 2002·Granted Dec 10, 2002·12 cites·7 claims
- 3767US7728416B2Semiconductor device, a method of manufacturing the same and an electronic deviceRENESAS TECH CORP·Filed 2008·Granted Jun 1, 2010·2 cites·13 claims
- 3865US10885806B2Musical score processing method and musical score processing systemYAMAHA CORP·Filed 2019·Granted Jan 5, 2021·0 cites·6 claims
- 3964US2025201678A1Semiconductor device and method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 4064US2025183131A1Semiconductor device, electronic device, and method of manufacturing electronic deviceRENESAS ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 4163US7160760B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted Jan 9, 2007·7 cites·8 claims
- 4262US7385279B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2006·Granted Jun 10, 2008·1 cites·3 claims
- 4362US6711000B2Aluminum electrolytic capacitor and process of producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 23, 2004·14 cites·5 claims
- 4462US6573119B1Semiconductor device and method of manufacture thereofHITACHI LTD·Filed 1999·Granted Jun 3, 2003·28 cites·5 claims
- 4562US6320270B1Semiconductor device and method of producing the sameHITACHI LTD·Filed 2000·Granted Nov 20, 2001·7 cites·4 claims
- 4662US2025327144A1Traverse hardening deviceNIPPON STEEL CORP·Filed 2022·Application pending·0 cites
- 4761US12377888B2Railway axleNIPPON STEEL CORP·Filed 2021·Granted Aug 5, 2025·0 cites·2 claims
- 4861US12374647B2Semiconductor device including chip-to-chip bondingRENESAS ELECTRONICS CORP·Filed 2022·Granted Jul 29, 2025·0 cites·16 claims
- 4960US12506016B2Method of manufacturing semiconductor device using different types of plating filmsRENESAS ELECTRONICS CORP·Filed 2023·Granted Dec 23, 2025·0 cites·9 claims
- 5060US9165901B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2014·Granted Oct 20, 2015·0 cites·7 claims
Showing the top 50 of 87 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →