Inventor · disambiguated record
Tomoko Hatsukade
Also filed as: HATSUKADE TOMOKO
0 granted patents·5 pending applications·0 citations·filing 2014–2022
Files withADEKA CORP5
Top patents by PatentIndex Score
5 records- 0158US2016053394A1Additive for copper electroplating bath, copper electroplating bath containing said additive, and copper electroplating method using said copper electroplating bathADEKA CORP·Filed 2014·Application pending·0 cites
- 0249US2024132453A1Additive for electroplating solution, electroplating solution, electroplating method, and method of producing metal layerADEKA CORP·Filed 2022·Application pending·0 cites
- 0347US2018135196A1Additive for copper electroplating bath, copper electroplating bath containing said additive, and copper electroplating method using said copper electroplating bathADEKA CORP·Filed 2017·Application pending·0 cites
- 0445US2023025950A1Copper electroplating solution, method of producing same, and copper electroplating methodADEKA CORP·Filed 2020·Application pending·0 cites
- 0543US2022220065A1Additive for electroplating solutions, electroplating solution, electroplating method and novel compoundADEKA CORP·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →