Inventor · disambiguated record
Toru Hizume
Also filed as: HIZUME TORU
5 granted patents·4 pending applications·43 citations·filing 1997–2019
77Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0174US9299678B2Semiconductor package and manufacturing method thereforKYOZUKA MASAHIRO·Filed 2011·Granted Mar 29, 2016·5 cites·9 claims
- 0273US10779406B2Wiring substrateSHINKO ELECTRIC IND CO·Filed 2019·Granted Sep 15, 2020·2 cites·5 claims
- 0370US8017503B2Manufacturing method of semiconductor packageSHINKO ELECTRIC IND CO·Filed 2010·Granted Sep 13, 2011·3 cites·10 claims
- 0465US6150194ASemiconductor device sealed with resin, and its manufactureSHINKO ELECTRIC IND CO·Filed 1997·Granted Nov 21, 2000·31 cites·4 claims
- 0549US2009135574A1Wiring board, semiconductor device having wiring board, and method of manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 0644US2008303153A1Semiconductor device, manufacturing method thereof, and semiconductor device productSHINKO ELECTRIC IND CO·Filed 2008·Application pending·0 cites
- 0743US6285087B1Resin-shield type semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2000·Granted Sep 4, 2001·2 cites·15 claims
- 0843US2011010932A1Wiring board, semiconductor device having wiring board, and method of manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2010·Application pending·0 cites
- 0933US2010225001A1Manufacturing method of semiconductor device, semiconductor device, and electronic deviceSHINKO ELECTRIC IND CO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →