Inventor · disambiguated record
Tosiyuki Honda
Also filed as: HONDA TOSIYUKI
6 granted patents·446 citations·filing 1992–1996
88Inventor score
Technology areasH10W
Files withFUJITSU LTD6
Top patents by PatentIndex Score
6 records- 0193US5724233ASemiconductor device having first and second semiconductor chips with a gap therebetween, a die stage in the gap and associated lead frames disposed in a package, the lead frames providing electrical connections from the chips to an exterior of the packagFUJITSU LTD·Filed 1996·Granted Mar 3, 1998·180 cites·7 claims
- 0292US5471369ASemiconductor device having a plurality of semiconductor chipsFUJITSU LTD·Filed 1994·Granted Nov 28, 1995·148 cites·8 claims
- 0380US5579208ASemiconductor device having a plurality of semiconductor chipsFUJITSU LTD·Filed 1995·Granted Nov 26, 1996·59 cites·7 claims
- 0464US5479051ASemiconductor device having a plurality of semiconductor chipsFUJITSU LTD·Filed 1993·Granted Dec 26, 1995·41 cites·17 claims
- 0547US5309016ASemiconductor integrated circuit device having terminal members provided between semiconductor element and leadsFUJITSU LTD·Filed 1992·Granted May 3, 1994·14 cites·18 claims
- 0633US5361970AMethod of producing a semiconductor integrated circuit device having terminal members provided between semiconductor element and leadsFUJITSU LTD·Filed 1994·Granted Nov 8, 1994·4 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →