Inventor · disambiguated record
Tomoaki Ichikawa
Also filed as: ICHIKAWA TOMOAKI
24 granted patents·20 pending applications·37 citations·filing 2003–2022
92Inventor score
Top patents by PatentIndex Score
44 records- 0182US11948907B2LaminateNITTO DENKO CORP·Filed 2021·Granted Apr 2, 2024·1 cites·6 claims
- 0280US8561741B2Air guide duct structure for vehicleKUROKAWA HIDETOSHI·Filed 2010·Granted Oct 22, 2013·14 cites·11 claims
- 0375US9340700B2Epoxy resin composition for semiconductor encapsulation and semiconductor device using the sameIWASHIGE TOMOHITO·Filed 2012·Granted May 17, 2016·5 cites·5 claims
- 0469US8092935B2Reactive polymer-carrying porous film and process for producing the sameICHIKAWA TOMOAKI·Filed 2005·Granted Jan 10, 2012·2 cites·5 claims
- 0567US11676936B2Manufacturing method for semiconductor deviceNITTO DENKO CORP·Filed 2019·Granted Jun 13, 2023·1 cites·18 claims
- 0667US11594513B2Manufacturing method for semiconductor deviceNITTO DENKO CORP·Filed 2019·Granted Feb 28, 2023·1 cites·6 claims
- 0767US8277968B2Reactive polymer-supporting porous film for battery separator and use thereofICHIKAWA TOMOAKI·Filed 2006·Granted Oct 2, 2012·2 cites·17 claims
- 0867US7641246B2Bumper beam structureHONDA MOTOR CO LTD·Filed 2008·Granted Jan 5, 2010·6 cites·5 claims
- 0963US8729715B2Epoxy resin composition for semiconductor encapsulationIWASHIGE TOMOHITO·Filed 2012·Granted May 20, 2014·2 cites·6 claims
- 1061US7833654B2Adhesive-carrying porous film for battery separator and use thereofNITTO DENKO CORP·Filed 2004·Granted Nov 16, 2010·3 cites·7 claims
- 1160US8911648B2Reactive polymer-supported porous film for battery separator, method for producing the porous film, method for producing battery using the porous film, and electrode/porous film assemblyUETANI YOSHIHIRO·Filed 2012·Granted Dec 16, 2014·0 cites·3 claims
- 1257US9340653B2Method for production of porous film, porous film, separator for non-aqueous electrolyte battery, and non-aqueous electrolyte battery using the separatorNITTO DENKO CORP·Filed 2015·Granted May 17, 2016·0 cites·8 claims
- 1357US2022325091A1Thermosetting sheet and dicing die bonding filmNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 1456US9077025B2Method for production of porous film, porous film, separator for non-aqueous electrolyte battery, and non-aqueous electrolyte battery using the separatorNOUMI SHUNSUKE·Filed 2008·Granted Jul 7, 2015·0 cites·7 claims
- 1556US8357260B2Partially crosslinked adhesive-supported porous film for battery separator and its useNITTO DENKO CORP·Filed 2011·Granted Jan 22, 2013·0 cites·1 claims
- 1654US2006099497A1Reactive polymer-supported porous film for battery separator, method for producing the porous film, method for producing battery using the porous film, and electrode/porous film assemblyNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 1753US11791302B2Thermosetting sheet, dicing die bonding film, and semiconductor apparatusNITTO DENKO CORP·Filed 2021·Granted Oct 17, 2023·0 cites·5 claims
- 1853US11697567B2Wound body of sheet for sintering bonding with base materialNITTO DENKO CORP·Filed 2020·Granted Jul 11, 2023·0 cites·8 claims
- 1950US2022157637A1Dicing die bonding filmNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 2048US11352527B2Sinter-bonding composition, sinter-bonding sheet and dicing tape with sinter-bonding sheetNITTO DENKO CORP·Filed 2018·Granted Jun 7, 2022·0 cites·8 claims
- 2147US11839936B2Sheet for sintering bonding and sheet for sintering bonding with base materialNITTO DENKO CORP·Filed 2020·Granted Dec 12, 2023·0 cites·20 claims
- 2247US10879103B2Mounting memberNITTO DENKO CORP·Filed 2017·Granted Dec 29, 2020·0 cites·7 claims
- 2346US11420832B2Transport fixing jigNITTO DENKO CORP·Filed 2017·Granted Aug 23, 2022·0 cites·9 claims
- 2446US2004101757A1Partially crosslinked adhesive-supported porous film for battery separator and its useNITTO DENKO CORP·Filed 2003·Application pending·0 cites
- 2545US10796941B2Mounting memberNITTO DENKO CORP·Filed 2017·Granted Oct 6, 2020·0 cites·8 claims
- 2645US2021139746A1Thermosetting sheet and dicing die bonding filmNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 2745US2021139745A1Thermosetting sheet and dicing die bonding filmNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 2844US11456215B2Manufacturing method for semiconductor deviceNITTO DENKO CORP·Filed 2019·Granted Sep 27, 2022·0 cites·10 claims
- 2944US11390525B2Carbon nanotube aggregate comprising a non-aligned portionNITTO DENKO CORP·Filed 2017·Granted Jul 19, 2022·0 cites·6 claims
- 3044US2020294952A1Sheet for sintering bonding, sheet for sintering bonding with base material, and semiconductor chip with layer of material for sintering bondingNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 3144US2020294951A1Sheet for sintering bonding and sheet for sintering bonding with base materialNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 3244US2020294961A1Sheet for sintering bonding and sheet for sintering bonding with base materialNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 3344US2022230989A1Semiconductor device and method for producing semiconductor deviceNITTO DENKO CORP·Filed 2022·Application pending·0 cites
- 3443US10777446B2Mounting memberNITTO DENKO CORP·Filed 2017·Granted Sep 15, 2020·0 cites·6 claims
- 3542US2019177165A1Carbon nanotube aggregateNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 3642US2020039826A1Carbon nanotube aggregateNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 3740US2021403784A1Thermosetting sheet and dicing die bonding filmNITTO DENKO CORP·Filed 2021·Application pending·0 cites
- 3839US2004080068A1Process of producing porous filmsNITTO DENKO CORP·Filed 2003·Application pending·0 cites
- 3938US2021174984A1Sinter-bonding composition, sinter-bonding sheet and dicing tape with sinter-bonding sheetNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 4037US2013127071A1Epoxy resin composition for semiconductor encapsulation and semiconductor device using the sameSUGIMOTO NAOYA·Filed 2012·Application pending·0 cites
- 4137US2019218426A1Adhesive structureNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 4235US2012153512A1Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained using the sameSUGIMOTO NAOYA·Filed 2011·Application pending·0 cites
- 4335US2012115281A1Method of manufacturing semiconductor deviceIWASHIGE TOMOHITO·Filed 2011·Application pending·0 cites
- 4433US2010308477A1Epoxy resin composition for semiconductor encapsulation and semiconductor device using the sameNITTO DENKO CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →