Inventor · disambiguated record
Tomohiro Iguchi
Also filed as: IGUCHI TOMOHIRO
27 granted patents·24 pending applications·312 citations·filing 2000–2025
95Inventor score
Top patents by PatentIndex Score
51 records- 0197US10410976B2Method of manufacturing semiconductor chip, semiconductor chip, and semiconductor deviceTOSHIBA KK·Filed 2016·Granted Sep 10, 2019·24 cites·9 claims
- 0295US6528870B2Semiconductor device having a plurality of stacked wiring boardsTOSHIBA KK·Filed 2001·Granted Mar 4, 2003·179 cites·9 claims
- 0390US11605613B2Semiconductor deviceTOSHIBA KK·Filed 2021·Granted Mar 14, 2023·2 cites·16 claims
- 0489US11776892B2Semiconductor deviceTOSHIBA KK·Filed 2020·Granted Oct 3, 2023·2 cites·7 claims
- 0587US6447946B1Lithium-ion batterySHIN KOBE ELECTRIC MACHINERY·Filed 2000·Granted Sep 10, 2002·35 cites·18 claims
- 0685US8975732B2Semiconductor device and method of manufacturing the sameTOSHIBA KK·Filed 2013·Granted Mar 10, 2015·8 cites·12 claims
- 0784US6733925B2Non-aqueous electrolytic solution secondary battery with electrodes having a specific thickness and porositySHIN KOBE ELECTRIC MACHINERY·Filed 2001·Granted May 11, 2004·31 cites·24 claims
- 0879US7278199B2Method of making a thermoelectric deviceTOSHIBA KK·Filed 2006·Granted Oct 9, 2007·8 cites·9 claims
- 0977US2025385580A1Wound-field rotating electric machineDENSO CORP·Filed 2025·Application pending·0 cites
- 1077US2025385581A1Wound-field rotorDENSO CORP·Filed 2025·Application pending·0 cites
- 1174US12165965B2Semiconductor deviceTOSHIBA KK·Filed 2023·Granted Dec 10, 2024·0 cites·6 claims
- 1273US12080680B2Semiconductor deviceTOSHIBA KK·Filed 2022·Granted Sep 3, 2024·0 cites·6 claims
- 1373US7024865B2Thermoelectric deviceTOSHIBA KK·Filed 2004·Granted Apr 11, 2006·12 cites·20 claims
- 1472US7656034B2Semiconductor device and method for manufacturing the sameTOSHIBA KK·Filed 2008·Granted Feb 2, 2010·5 cites·3 claims
- 1569US9460967B2Method of manufacturing semiconductor chip, semiconductor chip, and semiconductor deviceTOSHIBA KK·Filed 2014·Granted Oct 4, 2016·2 cites·14 claims
- 1666US11462508B2Semiconductor deviceTOSHIBA KK·Filed 2020·Granted Oct 4, 2022·0 cites·8 claims
- 1766US10727209B2Semiconductor device and semiconductor element with improved yieldTOSHIBA KK·Filed 2018·Granted Jul 28, 2020·1 cites·6 claims
- 1857US8008773B2Semiconductor device and method for fabricating semiconductor deviceTOSHIBA KK·Filed 2009·Granted Aug 30, 2011·1 cites·8 claims
- 1957US2024355693A1Semiconductor device, semiconductor module, and method for manufacturing semiconductor moduleTOSHIBA KK·Filed 2024·Application pending·0 cites
- 2056US2024312947A1Semiconductor deviceTOSHIBA KK·Filed 2023·Application pending·0 cites
- 2154US8193643B2Semiconductor device and method for fabricating the sameTOJO AKIRA·Filed 2009·Granted Jun 5, 2012·2 cites·8 claims
- 2254US8039857B2Optical semiconductor device and method of manufacturing optical semiconductor deviceTOSHIBA KK·Filed 2009·Granted Oct 18, 2011·0 cites·6 claims
- 2354US2023299038A1Semiconductor device and method for producing semiconductor deviceTOSHIBA KK·Filed 2022·Application pending·0 cites
- 2454US2023078259A1Semiconductor deviceTOSHIBA KK·Filed 2022·Application pending·0 cites
- 2553US12355015B2Semiconductor deviceTOSHIBA KK·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 2650US2007256427A1Thermoelectric deviceTOSHIBA KK·Filed 2007·Application pending·0 cites
- 2749US10086478B2Metallic particle paste, cured product using same, and semiconductor deviceTOSHIBA KK·Filed 2014·Granted Oct 2, 2018·0 cites·13 claims
- 2846US8241937B2Optical semiconductor device and method of manufacturing optical semiconductor deviceHAPPOYA AKIHIKO·Filed 2011·Granted Aug 14, 2012·0 cites·2 claims
- 2945US11081412B2Semiconductor deviceTOSHIBA KK·Filed 2020·Granted Aug 3, 2021·0 cites·18 claims
- 3045US2009072390A1Semiconductor apparatus and fabrication method thereofTOSHIBA KK·Filed 2008·Application pending·0 cites
- 3144US10199365B2Semiconductor moduleTOSHIBA KK·Filed 2018·Granted Feb 5, 2019·0 cites·20 claims
- 3243US11098703B2Variable displacement compressor with variation in discharge capacitySANDEN AUTOMOTIVE COMPONENTS CORP·Filed 2018·Granted Aug 24, 2021·0 cites·2 claims
- 3343US8378479B2Semiconductor device and method for fabricating semiconductor deviceTOSHIBA KK·Filed 2011·Granted Feb 19, 2013·0 cites·1 claims
- 3443US2008179751A1Manufacturing method of semiconductor devices and semiconductor device manufactured therebyTOSHIBA KK·Filed 2008·Application pending·0 cites
- 3543US2008217754A1Semiconductor device and manufacturing method thereofTOSHIBA KK·Filed 2008·Application pending·0 cites
- 3643US2008073794A1Semiconductor apparatus and fabrication method thereofTOSHIBA KK·Filed 2007·Application pending·0 cites
- 3742US2007034882A1Semiconductor light-emitting deviceFUJII TAKAYOSHI·Filed 2006·Application pending·0 cites
- 3842US2015076516A1Semiconductor device and semiconductor moduleTOSHIBA KK·Filed 2014·Application pending·0 cites
- 3941US9202757B2Semiconductor module and method for manufacturing sameTOSHIBA KK·Filed 2013·Granted Dec 1, 2015·0 cites·18 claims
- 4041US2014284797A1Power semiconductor device fabrication method, power semiconductor deviceTOSHIBA KK·Filed 2013·Application pending·0 cites
- 4140US7205239B2Method of manufacturing semiconductor wafer and method of manufacturing semiconductor deviceTOSHIBA KK·Filed 2005·Granted Apr 17, 2007·0 cites·9 claims
- 4240US2006042675A1Thermoelectric device and method of manufacturing the sameTOSHIBA KK·Filed 2005·Application pending·0 cites
- 4339US2005211288A1Thermoelectric deviceTOSHIBA KK·Filed 2005·Application pending·0 cites
- 4439US2018308833A1Semiconductor deviceTOSHIBA KK·Filed 2018·Application pending·0 cites
- 4538US2010244869A1Probe for electrical inspection, method for fabricating the same, and method for fabricating a semiconductor deviceTOSHIBA KK·Filed 2010·Application pending·0 cites
- 4636US2017170150A1Semiconductor module and semiconductor deviceTOSHIBA KK·Filed 2016·Application pending·0 cites
- 4736US2009209065A1Method of manufacturing semiconductor device and ultrasonic bonding apparatusNISHIUCHI HIDEO·Filed 2009·Application pending·0 cites
- 4836US2017050842A1Printed wiring board and magneticshield packageTOSHIBA KK·Filed 2016·Application pending·0 cites
- 4935US2011186982A1Surface mount diode and method of fabricating the sameTOSHIBA KK·Filed 2011·Application pending·0 cites
- 5033US2016035657A1Semiconductor device and semiconductor moduleTOSHIBA KK·Filed 2015·Application pending·0 cites
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →