Inventor · disambiguated record
Tomoyuki Ikeda
Also filed as: IKEDA TOMOYUKI
25 granted patents·4 pending applications·207 citations·filing 1997–2024
95Inventor score
Top patents by PatentIndex Score
29 records- 0195US7786390B2Printed wiring board and a method of production thereofIBIDEN CO LTD·Filed 2008·Granted Aug 31, 2010·29 cites·20 claims
- 0294US7378602B2Multilayer core board and manufacturing method thereofIBIDEN CO LTD·Filed 2005·Granted May 27, 2008·36 cites·7 claims
- 0390US9807885B2Wiring board with built-in electronic component and method for manufacturing the sameIBIDEN CO LTD·Filed 2016·Granted Oct 31, 2017·8 cites·20 claims
- 0489US7371974B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2002·Granted May 13, 2008·43 cites·36 claims
- 0587US10344661B2Engine systemYANMAR CO LTD·Filed 2015·Granted Jul 9, 2019·5 cites·14 claims
- 0686US8242379B2Multilayered printed wiring board with a multilayered core substrateIKEDA TOMOYUKI·Filed 2007·Granted Aug 14, 2012·18 cites·18 claims
- 0785US8101865B2Printed wiring board and a method of production thereofIKEDA TOMOYUKI·Filed 2009·Granted Jan 24, 2012·8 cites·20 claims
- 0877US9029711B2Method for manufacturing a printed wiring board having a through-hole conductorIKEDA TOMOYUKI·Filed 2011·Granted May 12, 2015·2 cites·20 claims
- 0977US7905014B2Manufacturing method of multilayer core boardIBIDEN CO LTD·Filed 2007·Granted Mar 15, 2011·6 cites·5 claims
- 1070US8030579B2Multilayer printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Oct 4, 2011·3 cites·40 claims
- 1169US9040843B2Multilayer printed wiring boardTOYODA YUKIHIKO·Filed 2012·Granted May 26, 2015·2 cites·22 claims
- 1266US6087010AFluorine-containing polyfunctional (meth) acrylate composition low refractivity material and reflection reducing filmNOF CORP·Filed 1997·Granted Jul 11, 2000·25 cites·10 claims
- 1365US8966750B2Method of manufacturing a multilayered printed wiring boardIKEDA TOMOYUKI·Filed 2011·Granted Mar 3, 2015·1 cites·17 claims
- 1464US8324506B2Printed wiring board and a method of production thereofIKEDA TOMOYUKI·Filed 2009·Granted Dec 4, 2012·1 cites·20 claims
- 1562US12169312B2Semiconductor packageIBIDEN CO LTD·Filed 2022·Granted Dec 17, 2024·0 cites·20 claims
- 1662US2025126709A1Printed wiring boardIBIDEN CO LTD·Filed 2024·Application pending·0 cites
- 1761US6254973B1Fluorine-containing polyfunctional (meth) acrylate, fluorine containing monomer composition, low refractivity material, and reflection reducing filmNOF CORP·Filed 1997·Granted Jul 3, 2001·20 cites·12 claims
- 1858US12189193B2Semiconductor packageIBIDEN CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 1957US8890000B2Printed wiring board having through-hole and a method of production thereofIKEDA TOMOYUKI·Filed 2012·Granted Nov 18, 2014·0 cites·20 claims
- 2056US12193156B2Wiring substrate and method for manufacturing wiring substrateIBIDEN CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·20 claims
- 2156US2015216055A1Method for manufacturing printed wiring boardIBIDEN CO LTD·Filed 2015·Application pending·0 cites
- 2255US12213248B2Printed wiring boardIBIDEN CO LTD·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 2353US11715698B2Wiring substrateIBIDEN CO LTD·Filed 2022·Granted Aug 1, 2023·0 cites·20 claims
- 2453US2023069980A1Method for manufacturing wiring substrateIBIDEN CO LTD·Filed 2022·Application pending·0 cites
- 2548US8324512B2Multilayer printed wiring boardTOYODA YUKIHIKO·Filed 2011·Granted Dec 4, 2012·0 cites·35 claims
- 2645US2022377883A1Printed wiring boardIBIDEN CO LTD·Filed 2022·Application pending·0 cites
- 2740US11089674B2Wiring substrate and method for manufacturing wiring substrateIBIDEN CO LTD·Filed 2020·Granted Aug 10, 2021·0 cites·20 claims
- 2839US11277910B2Wiring substrateIBIDEN CO LTD·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
- 2938US10291100B2Engine systemYANMAR CO LTD·Filed 2015·Granted May 14, 2019·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →