Inventor · disambiguated record
Toshinori Imai
Also filed as: IMAI TOSHINORI
29 granted patents·5 pending applications·515 citations·filing 1998–2011
97Inventor score
Top patents by PatentIndex Score
34 records- 0192US6818546B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2001·Granted Nov 16, 2004·50 cites·35 claims
- 0291US7659201B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2008·Granted Feb 9, 2010·10 cites·26 claims
- 0391US6908847B2Method of manufacturing a semiconductor device having an interconnect embedded in an insulating filmRENESAS TECH CORP·Filed 2002·Granted Jun 21, 2005·46 cites·17 claims
- 0490US6326299B1Method for manufacturing a semiconductor deviceHITACHI LTD·Filed 1999·Granted Dec 4, 2001·88 cites·45 claims
- 0589US8212649B2Semiconductor device and manufacturing method of the sameFUJIWARA TSUYOSHI·Filed 2011·Granted Jul 3, 2012·10 cites·10 claims
- 0687US7642652B2Semiconductor integrated circuit device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted Jan 5, 2010·9 cites·21 claims
- 0786US6509273B1Method for manufacturing a semiconductor deviceHITACHI LTD·Filed 2000·Granted Jan 21, 2003·36 cites·45 claims
- 0885US6376345B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 1999·Granted Apr 23, 2002·46 cites·107 claims
- 0984US7582901B2Semiconductor device comprising metal insulator metal (MIM) capacitorHITACHI LTD·Filed 2005·Granted Sep 1, 2009·12 cites·7 claims
- 1084US7510970B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2006·Granted Mar 31, 2009·5 cites·8 claims
- 1182US6458674B1Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Oct 1, 2002·16 cites·101 claims
- 1281US6638854B2Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2002·Granted Oct 28, 2003·25 cites·16 claims
- 1381US6561875B1Apparatus and method for producing substrate with electrical wire thereonHITACHI LTD·Filed 2000·Granted May 13, 2003·20 cites·26 claims
- 1480US7981761B2Method of manufacturing semiconductor device having MIM capacitorHITACHI LTD·Filed 2010·Granted Jul 19, 2011·6 cites·5 claims
- 1580US7053487B2Semiconductor deviceRENESASTECHNOLOGY CORP·Filed 2002·Granted May 30, 2006·24 cites·37 claims
- 1678US8183616B2Semiconductor device, RF-IC and manufacturing method of the sameFUJIWARA TSUYOSHI·Filed 2010·Granted May 22, 2012·5 cites·10 claims
- 1778US6531400B2Process for manufacturing semiconductor integrated circuit deviceHITACHI LTD·Filed 2002·Granted Mar 11, 2003·12 cites·30 claims
- 1874US6982200B2Semiconductor device manufacturing methodRENESAS TECH CORP·Filed 2003·Granted Jan 3, 2006·21 cites·10 claims
- 1972US8048735B2Manufacturing method of semiconductor deviceHITACHI LTD·Filed 2007·Granted Nov 1, 2011·5 cites·9 claims
- 2072US8040214B2Semiconductor device and manufacturing method of the sameHITACHI LTD·Filed 2009·Granted Oct 18, 2011·4 cites·10 claims
- 2172US6696357B2Method for manufacturing semiconductor integrated circuit devices using a conductive layer to prevent peeling between a bonding pad and an underlying insulating filmRENESAS TECH CORP·Filed 2002·Granted Feb 24, 2004·20 cites·16 claims
- 2271US7321171B2Semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Jan 22, 2008·10 cites·18 claims
- 2371US6800557B2Process for manufacturing semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2003·Granted Oct 5, 2004·8 cites·5 claims
- 2469US8174355B2Semiconductor device and method for manufacturing the sameTAKEDA KENICHI·Filed 2008·Granted May 8, 2012·4 cites·5 claims
- 2561US6734104B2Method of manufacturing a semiconductor device and a semiconductor deviceRENESAS TECH CORP·Filed 2002·Granted May 11, 2004·7 cites·13 claims
- 2659US6495466B2Method of manufacturing a semiconductor device and a semiconductor deviceHITACHI LTD·Filed 2001·Granted Dec 17, 2002·6 cites·53 claims
- 2756US6855035B2Apparatus and method for producing substrate with electrical wire thereonRENESAS TECH CORP·Filed 2002·Granted Feb 15, 2005·5 cites·42 claims
- 2851US2010013568A1Semiconductor device, rf-ic and manufacturing method of the sameRENESAS TECH CORP·Filed 2009·Application pending·0 cites
- 2949US8129275B2Process for manufacturing semiconductor integrated circuit deviceOHASHI NAOFUMI·Filed 2010·Granted Mar 6, 2012·0 cites·15 claims
- 3046US2008203531A1Semiconductor device and manufacturing method thereofIMAI TOSHINORI·Filed 2008·Application pending·0 cites
- 3145US2004152298A1Process for manufacturing semiconductor integrated circuit deviceFiled 2004·Application pending·0 cites
- 3244US2006289917A1Semiconductor device, RF-IC and manufacturing method of the sameFUJIWARA TSUYOSHI·Filed 2006·Application pending·0 cites
- 3340US2002025605A1Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2001·Application pending·0 cites
- 3433US6042647ANozzle system for feeding treatment liquid such as a liquid developer on a workpieceTOKYO OHKA KOGYO CO LTD·Filed 1998·Granted Mar 28, 2000·5 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →