Inventor · disambiguated record
Toshihiko Ito
Also filed as: ITO TOSHIHIKO
18 granted patents·1 pending application·401 citations·filing 1980–2020
95Inventor score
Top patents by PatentIndex Score
19 records- 0194US11413649B2Viscous material discharge deviceKAWASAKI HEAVY IND LTD·Filed 2020·Granted Aug 16, 2022·4 cites·3 claims
- 0290US6522052B2Multilayer-type piezoelectric actuatorDENSO CORP·Filed 2001·Granted Feb 18, 2003·78 cites·9 claims
- 0389US4354820AExtrusion die and method for producing extrusion die for forming a honeycomb structureNIPPON SOKEN·Filed 1981·Granted Oct 19, 1982·59 cites·12 claims
- 0486US4373895AExtrusion die and method for producing extrusion die for forming a honeycomb structureNIPPON SOKEN·Filed 1980·Granted Feb 15, 1983·45 cites·49 claims
- 0584US4381912AExtrusion die for forming a honeycomb structureNIPPON SOKEN·Filed 1981·Granted May 3, 1983·41 cites·9 claims
- 0682US6692793B2Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such filmHITACHI CHEMICAL CO LTD·Filed 2001·Granted Feb 17, 2004·16 cites·15 claims
- 0774US6238840B1Photosensitive resin compositionHITACHI CHEMICAL CO LTD·Filed 1998·Granted May 29, 2001·38 cites·12 claims
- 0873US4384841AExtrusion die for extruding a honeycomb structureNIPPON SOKEN·Filed 1981·Granted May 24, 1983·30 cites·6 claims
- 0969US4407622ASoil transporting vehicle for transporting soils excavated by shield machineOKUMURA CORP·Filed 1981·Granted Oct 4, 1983·16 cites·1 claims
- 1064US4795785ACoating resin compositionHITACHI CHEMICAL CO LTD·Filed 1986·Granted Jan 3, 1989·16 cites·8 claims
- 1162US6583198B2Photo curable resin composition and photosensitive elementHITACHI CHEMICAL CO LTD·Filed 1998·Granted Jun 24, 2003·15 cites·9 claims
- 1258US4640454AMethod for producing extrusion die for forming a honeycomb structureNIPPON SOKEN·Filed 1983·Granted Feb 3, 1987·15 cites·6 claims
- 1357US7071243B2Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such filmHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jul 4, 2006·3 cites·12 claims
- 1446US5885723ABonding film for printed circuit boardsHITACHI CHEMICAL CO LTD·Filed 1997·Granted Mar 23, 1999·12 cites·12 claims
- 1539US5625026AAmid group-containing diisocyanates and amide group-containing epoxy resinsHITACHI CHEMICAL CO LTD·Filed 1994·Granted Apr 29, 1997·1 cites·10 claims
- 1639US2002169226A1Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such filmFiled 2002·Application pending·0 cites
- 1737US6801504B1Node device of ATM communication network and method of failure alarm notificationNEC CORP·Filed 1999·Granted Oct 5, 2004·12 cites·6 claims
- 1830US5874518AEpoxy-modified polyamide resinHITACHI CHEMICAL CO LTD·Filed 1994·Granted Feb 23, 1999·0 cites·28 claims
- 1929US5591813AAmide group-containing diisocyanates and amide group-containing epoxy resinsHITACHI CHEMICAL CO LTD·Filed 1995·Granted Jan 7, 1997·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →