Inventor · disambiguated record
Tomohito Iwashige
Also filed as: IWASHIGE TOMOHITO
8 granted patents·9 pending applications·8 citations·filing 2011–2025
76Inventor score
Top patents by PatentIndex Score
17 records- 0178US11101246B2Semiconductor device having chips attached to support members through silver sintered bodies with particlesDENSO CORP·Filed 2020·Granted Aug 24, 2021·1 cites·7 claims
- 0275US9340700B2Epoxy resin composition for semiconductor encapsulation and semiconductor device using the sameIWASHIGE TOMOHITO·Filed 2012·Granted May 17, 2016·5 cites·5 claims
- 0363US8729715B2Epoxy resin composition for semiconductor encapsulationIWASHIGE TOMOHITO·Filed 2012·Granted May 20, 2014·2 cites·6 claims
- 0460US2024395653A1Heat dissipation member, method of manufacturing the heat dissipation member, and semiconductor device including the heat dissipation memberDENSO CORP·Filed 2024·Application pending·0 cites
- 0559US2024297095A1Heat transport device and semiconductor moduleDENSO CORP·Filed 2024·Application pending·0 cites
- 0655US2024145423A1Connection structure, semiconductor device, and insulation substrateDENSO CORP·Filed 2023·Application pending·0 cites
- 0752US2022359229A1Semiconductor device and method for manufacturing the semiconductor deviceDENSO CORP·Filed 2022·Application pending·0 cites
- 0849US10804237B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Oct 13, 2020·0 cites·4 claims
- 0949US2025388475A1Silicon carbide filler, composite material, and semiconductor deviceDENSO CORP·Filed 2025·Application pending·0 cites
- 1047US10763204B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Sep 1, 2020·0 cites·6 claims
- 1145US11557563B2Sinter sheet, semiconductor device and manufacturing method thereofDENSO CORP·Filed 2020·Granted Jan 17, 2023·0 cites·10 claims
- 1245US9536802B2Semiconductor deviceDENSO CORP·Filed 2014·Granted Jan 3, 2017·0 cites·6 claims
- 1344US10943847B2Semiconductor chip and semiconductor deviceDENSO CORP·Filed 2018·Granted Mar 9, 2021·0 cites·10 claims
- 1441US2025316636A1Semiconductor deviceDENSO CORP·Filed 2025·Application pending·0 cites
- 1537US2013127071A1Epoxy resin composition for semiconductor encapsulation and semiconductor device using the sameSUGIMOTO NAOYA·Filed 2012·Application pending·0 cites
- 1635US2012153512A1Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained using the sameSUGIMOTO NAOYA·Filed 2011·Application pending·0 cites
- 1735US2012115281A1Method of manufacturing semiconductor deviceIWASHIGE TOMOHITO·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →