Inventor · disambiguated record
Tomoko Kato
Also filed as: KATO TOMOKO
30 granted patents·6 pending applications·306 citations·filing 1995–2017
96Inventor score
Files withDOW CORNING TORAY CO LTD12MORITA YOSHITSUGU7DOW CORNING TORAY SILICONE5KATO TOMOKO4JAPAN RADIO CO LTD2
Top patents by PatentIndex Score
36 records- 0193US8258502B2Light emitting device encapsulated with silicones and curable silicone compositions for preparing the siliconesYOSHITAKE MAKOTO·Filed 2007·Granted Sep 4, 2012·45 cites·19 claims
- 0292US7651887B2Optical semiconductor device and method of manufacturing thereofDOW CORNING TORAY CO LTD·Filed 2005·Granted Jan 26, 2010·23 cites·11 claims
- 0391US8044153B2Curable silicone compositionDOW CORNING TORAY CO LTD·Filed 2006·Granted Oct 25, 2011·10 cites·7 claims
- 0490US8796190B2Thermally conductive silicone grease compositionKATO TOMOKO·Filed 2009·Granted Aug 5, 2014·9 cites·5 claims
- 0588US8044162B2Adhesion-promoting agent, curable organopolysiloxane composition, and semiconductor deviceDOW CORNING TORAY CO LTD·Filed 2007·Granted Oct 25, 2011·7 cites·9 claims
- 0685US7763697B2Curable organopolysiloxane composition, use of the cured product of the composition, and semiconductor deviceDOW CORNING TORAY SILICONE·Filed 2007·Granted Jul 27, 2010·11 cites·10 claims
- 0784US10150902B2Thermally conductive silicone composition and electrical/electronic apparatusDOW CORNING TORAY CO LTD·Filed 2015·Granted Dec 11, 2018·5 cites·20 claims
- 0884US7527871B2Curable organopolysiloxane composition and semiconductor deviceDOW CORNING TORAY CO LTD·Filed 2004·Granted May 5, 2009·40 cites·12 claims
- 0983US8119744B2Curable silicone compositionMORITA YOSHITSUGU·Filed 2007·Granted Feb 21, 2012·5 cites·11 claims
- 1081US7994246B2Curable silicone composition and electronic componentDOW CORNING TORAY CO LTD·Filed 2007·Granted Aug 9, 2011·4 cites·15 claims
- 1181US7282270B2Curable organopolysiloxane composition and a semiconductor device made with the use of this compositionDOW CORNING TORAY SILICONE·Filed 2003·Granted Oct 16, 2007·32 cites·21 claims
- 1280US8373286B2Curable organopolysiloxane composition, optical semiconductor element sealant, and optical semiconductor deviceDOW CORNING TORAY CO LTD·Filed 2009·Granted Feb 12, 2013·9 cites·16 claims
- 1378US7842755B2Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoterDOW CORNING TORAY CO LTD·Filed 2005·Granted Nov 30, 2010·7 cites·16 claims
- 1477US8217388B2Curable organopolysiloxane composition and semiconductor deviceKATO TOMOKO·Filed 2007·Granted Jul 10, 2012·8 cites·14 claims
- 1576US6518204B2Curable organopolysiloxane composition and method of manufacturing semiconductor devices with the use of the aforementioned compositionDOW CORNING TORAY SILICONE·Filed 2002·Granted Feb 11, 2003·19 cites·13 claims
- 1675US8912132B2Thermally conductive silicone grease compositionKATO TOMOKO·Filed 2011·Granted Dec 16, 2014·2 cites·14 claims
- 1775US6513680B2Paste dispensing containerDOW CORNING TORAY SILICONE·Filed 2001·Granted Feb 4, 2003·20 cites·6 claims
- 1873US11319412B2Thermally conductive silicone compoundDOW TORAY CO LTD·Filed 2017·Granted May 3, 2022·2 cites·18 claims
- 1968US8633276B2Thermally conductive silicone composition and electronic deviceDOMAE NARUMASA·Filed 2009·Granted Jan 21, 2014·8 cites·12 claims
- 2068US8063143B2Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promotorMORITA YOSHITSUGU·Filed 2010·Granted Nov 22, 2011·2 cites·16 claims
- 2167US8338527B2Curable silicone composition and electronic componentsMORITA YOSHITSUGU·Filed 2006·Granted Dec 25, 2012·1 cites·10 claims
- 2262US5757649ACAD/CAM apparatusMITSUBISHI ELECTRIC CORP·Filed 1995·Granted May 26, 1998·30 cites·20 claims
- 2360US10077339B2Curable organopolysiloxane composition, and protective-agent or adhesive-agent composition for electrical/electronic componentsDOW CORNING TORAY CO LTD·Filed 2015·Granted Sep 18, 2018·1 cites·18 claims
- 2456US2011163460A1Thermally Conductive Silicone Composition And Semiconductor DeviceDOW CORNING TORAY CO LTD·Filed 2009·Application pending·0 cites
- 2552US2010022704A1Curable Silicone Composition And Cured Body ThereofMORITA YOSHITSUGU·Filed 2007·Application pending·0 cites
- 2648US7919150B2Method of manufacturing a layered silicone composite materialDOW CORNING TORAY CO LTD·Filed 2004·Granted Apr 5, 2011·2 cites·9 claims
- 2748US2009234078A1Organotrisiloxane, Preparation And Use In Curable Resin CompositionUEKI HIROSHI·Filed 2006·Application pending·0 cites
- 2848US2009214870A1Curable Silicone Composition And Electronic Device Produced TherefromMORITA YOSHITSUGU·Filed 2006·Application pending·0 cites
- 2947US8153202B2Method of manufacturing a layered silicone composite materialMORITA YOSHITSUGU·Filed 2011·Granted Apr 10, 2012·0 cites·9 claims
- 3047US7271232B2Curable organopolysiloxane composition, use of the cured product of the composition, and semiconductor deviceDOW CORNING TORAY SILICONE·Filed 2002·Granted Sep 18, 2007·2 cites·3 claims
- 3147US2015097138A1Thermally Conductive Silicone CompositionDOW CORNING TORAY CO LTD·Filed 2013·Application pending·0 cites
- 3244US8273815B2Curable silicone composition and electronic componentMORITA YOSHITSUGU·Filed 2007·Granted Sep 25, 2012·0 cites·11 claims
- 3344US6564451B2Hole filling method for a printed wiring boardJAPAN RADIO CO LTD·Filed 2001·Granted May 20, 2003·2 cites·4 claims
- 3440US2012280169A1Thermally Conductive Silicone Grease CompositionKATO TOMOKO·Filed 2011·Application pending·0 cites
- 3536US8802506B2Method of manufacturing a semiconductor device and a semiconductor device produced therebyISSHIKI MINORU·Filed 2007·Granted Aug 12, 2014·0 cites·18 claims
- 3633US6794585B2Printed circuit board having filled throughole with corner rounded portion and manufacturing methodJAPAN RADIO CO LTD·Filed 2001·Granted Sep 21, 2004·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →