Inventor · disambiguated record
Toshimi Kawahara
Also filed as: KAWAHARA TOSHIMI
25 granted patents·4 pending applications·1,207 citations·filing 1987–2005
97Inventor score
Files withFUJITSU LTD24FUJISTSU LIMITED1SHINKO ELECTRIC IND CO1SUMITOMO BAKELITE CO1TORAY INDUSTRIES1
Top patents by PatentIndex Score
29 records- 0196US6573121B2Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frameFUJITSU LTD·Filed 2001·Granted Jun 3, 2003·126 cites·15 claims
- 0296US6376921B1Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frameFUJITSU LTD·Filed 1998·Granted Apr 23, 2002·120 cites·11 claims
- 0392US6881611B1Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the deviceFUJITSU LTD·Filed 2000·Granted Apr 19, 2005·85 cites·24 claims
- 0489US6563330B1Probe card and method of testing wafer having a plurality of semiconductor devicesFUJITSU LTD·Filed 2000·Granted May 13, 2003·37 cites·18 claims
- 0589US6329711B1Semiconductor device and mounting structureFUJITSU LTD·Filed 1998·Granted Dec 11, 2001·122 cites·13 claims
- 0688US6379997B1Semiconductor device and method of producing the same and semiconductor device unit and method of producing the sameFUJITSU LTD·Filed 2000·Granted Apr 30, 2002·54 cites·11 claims
- 0787US6469370B1Semiconductor device and method of production of the semiconductor deviceFUJITSU LTD·Filed 2000·Granted Oct 22, 2002·54 cites·19 claims
- 0887US5679978ASemiconductor device having resin gate hole through substrate for resin encapsulationFUJITSU LTD·Filed 1994·Granted Oct 21, 1997·96 cites·15 claims
- 0986US6541848B2Semiconductor device including stud bumps as external connection terminalsFUJITSU LTD·Filed 1998·Granted Apr 1, 2003·58 cites·9 claims
- 1086US6111306ASemiconductor device and method of producing the same and semiconductor device unit and method of producing the sameFUJITSU LTD·Filed 1997·Granted Aug 29, 2000·83 cites·12 claims
- 1185US4788583ASemiconductor device and method of producing semiconductor deviceFUJITSU LTD·Filed 1987·Granted Nov 29, 1988·72 cites·16 claims
- 1281US6511620B1Method of producing semiconductor devices having easy separability from a metal mold after moldingFUJITSU LTD·Filed 2000·Granted Jan 28, 2003·35 cites·7 claims
- 1380US6437432B2Semiconductor device having improved electrical characteristics and method of producing the sameFUJITSU LTD·Filed 2000·Granted Aug 20, 2002·30 cites·17 claims
- 1477US6696754B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 2002·Granted Feb 24, 2004·20 cites·10 claims
- 1574US6507092B1Semiconductor device having increased reliability and method of producing the same and semiconductor chip suitable for such a semiconductor device and method of producing the sameFUJITSU LTD·Filed 2000·Granted Jan 14, 2003·21 cites·9 claims
- 1673US6207477B1Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 1998·Granted Mar 27, 2001·37 cites·9 claims
- 1773US5844309AAdhesive composition, semiconductor device using the composition and method for producing a semiconductor device using the compositionFUJITSU LTD·Filed 1996·Granted Dec 1, 1998·46 cites·14 claims
- 1870US7186575B2Manufacturing method of semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2005·Granted Mar 6, 2007·2 cites·5 claims
- 1968US6472744B2Semiconductor module including a plurality of semiconductor devices detachablyFUJITSU LTD·Filed 1998·Granted Oct 29, 2002·31 cites·17 claims
- 2063US6656996B2Semiconductor-sealing resin composition and semiconductor device using itSUMITOMO BAKELITE CO·Filed 2000·Granted Dec 2, 2003·11 cites·12 claims
- 2161US6774650B2Probe card and method of testing wafer having a plurality of semiconductor devicesFUJITSU LTD·Filed 2003·Granted Aug 10, 2004·7 cites·3 claims
- 2255US5616164AMethods for making metal particle spherical and removing oxide film solder paste and soldering methodFUJITSU LTD·Filed 1995·Granted Apr 1, 1997·18 cites·14 claims
- 2354US6361879B1Semiconductor device and method for fabricating it, and semiconductor sealing resin compositionTORAY INDUSTRIES·Filed 1999·Granted Mar 26, 2002·18 cites·32 claims
- 2448US5804467ASemiconductor device and method of producing the sameFUJISTSU LIMITED·Filed 1997·Granted Sep 8, 1998·15 cites·12 claims
- 2540US6034428ASemiconductor integrated circuit device having stacked wiring and insulating layersFUJITSU LTD·Filed 1996·Granted Mar 7, 2000·9 cites·7 claims
- 2640US2003132533A1Semiconductor device, method of manufacturing semiconductor device and a method of manufacturing lead frameFUJITSU LTD·Filed 2003·Application pending·0 cites
- 2738US2002030258A1Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the deviceFUJITSU LTD·Filed 2001·Application pending·0 cites
- 2838US2001001714A1Semiconductor device having a ball grid array and a fabrication process thereofFUJITSU LTD·Filed 2001·Application pending·0 cites
- 2930US2001003049A1Method and mold for manufacturing semiconductor device, semiconductor device, and method for mounting the deviceFiled 1997·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →