Inventor · disambiguated record
Tooru Kikuchi
Also filed as: KIKUCHI TOORU
16 granted patents·8 pending applications·111 citations·filing 1995–2022
91Inventor score
Top patents by PatentIndex Score
24 records- 0178US6099678ALaminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1995·Granted Aug 8, 2000·61 cites·36 claims
- 0275US11116029B2Mobility management entity, network entity, and method and computer readable medium thereforNEC CORP·Filed 2017·Granted Sep 7, 2021·2 cites·18 claims
- 0373US8524921B2Liquid tetracarboxylic dianhydrides and process for the preparation thereofKIKUCHI TOORU·Filed 2009·Granted Sep 3, 2013·2 cites·2 claims
- 0469US6825249B1Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2000·Granted Nov 30, 2004·17 cites·16 claims
- 0567US12122467B2Moving deviceTOKYO KEIKI INC·Filed 2019·Granted Oct 22, 2024·1 cites·18 claims
- 0667US7387914B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jun 17, 2008·2 cites·14 claims
- 0766US6717242B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Apr 6, 2004·12 cites·6 claims
- 0865US9999060B2Radio control system, communication apparatus, radio resource control method, and recording mediumNEC CORP·Filed 2014·Granted Jun 12, 2018·1 cites·20 claims
- 0960US6855579B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Feb 15, 2005·6 cites·14 claims
- 1054US7781896B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2008·Granted Aug 24, 2010·0 cites·3 claims
- 1153US7057265B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2003·Granted Jun 6, 2006·3 cites·13 claims
- 1250US7078094B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2004·Granted Jul 18, 2006·2 cites·27 claims
- 1350US2024262140A1Yawing Restricting DeviceTOKYO KEIKI INC·Filed 2022·Application pending·0 cites
- 1449US8592546B2Silicon-containing alicyclic polyimide resin, polyamic acid resin, and manufacturing method for sameKIKUCHI TOORU·Filed 2011·Granted Nov 26, 2013·0 cites·3 claims
- 1548US8594055B2Wireless communication system, base station, scheduling method, and programKIKUCHI TOORU·Filed 2009·Granted Nov 26, 2013·0 cites·20 claims
- 1648US2022187517A1Wavelength conversion member, backlight unit, image display device, and wavelength conversion resin compositionSHOWA DENKO MATERIALS CO LTD·Filed 2020·Application pending·0 cites
- 1747US7012320B2Semiconductor device and process for fabrication thereofHITACHI CHEMICAL CO LTD·Filed 2001·Granted Mar 14, 2006·2 cites·42 claims
- 1839US2010075475A1Method for producing a thin film transistor and method for forming an electrodeULVAC INC·Filed 2009·Application pending·0 cites
- 1937US2007290369A1Resin Paste For Die Bonding And Its UseHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 2036US2019075586A1Radio access network node, external node, and method thereforNEC CORP·Filed 2017·Application pending·0 cites
- 2136US2019090229A1Radio access network node, external node, and method thereforNEC CORP·Filed 2017·Application pending·0 cites
- 2235US9094160B2Base station, communication system, communication control method, and programKIKUCHI TOORU·Filed 2010·Granted Jul 28, 2015·0 cites·14 claims
- 2331US2013068544A1Wheel LoaderITOU NORITAKA·Filed 2011·Application pending·0 cites
- 2430US2007225438A1Resin Paste for Die BondingHASEGAWA YUJI·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →