Inventor · disambiguated record
Toshifumi Kojima
Also filed as: KOJIMA TOSHIFUMI · NAGAMINE TAKASHI
18 granted patents·2 pending applications·532 citations·filing 1977–2015
95Inventor score
Top patents by PatentIndex Score
20 records- 0196US6512182B2Wiring circuit board and method for producing sameNGK SPARK PLUG CO·Filed 2002·Granted Jan 28, 2003·136 cites·23 claims
- 0290US7404680B2Optical module, optical module substrate and optical coupling structureNGK SPARK PLUG CO·Filed 2005·Granted Jul 29, 2008·24 cites·10 claims
- 0390US6740411B2Embedding resin, wiring substrate using same and process for producing wiring substrate using sameNGK SPARK PLUG CO·Filed 2002·Granted May 25, 2004·46 cites·8 claims
- 0489US6822170B2Embedding resin and wiring substrate using the sameNGK SPARK PLUG CO·Filed 2001·Granted Nov 23, 2004·46 cites·10 claims
- 0588US6586827B2Wiring board and method for fabricating the sameNGK SPARK PLUG CO·Filed 2001·Granted Jul 1, 2003·44 cites·18 claims
- 0686US6876091B2Wiring boardNGK SPARK PLUG CO·Filed 2001·Granted Apr 5, 2005·34 cites·8 claims
- 0785US4988035AMethod of liquid phase diffusion bonding of metal bodiesNIPPON KOKAN KK·Filed 1989·Granted Jan 29, 1991·43 cites·12 claims
- 0882US7484897B2Optical module, optical module substrate and optical coupling structureNGK SPARK PLUG CO·Filed 2007·Granted Feb 3, 2009·11 cites·11 claims
- 0978US7183497B2Multilayer wiring boardNGK SPARK PLUG CO·Filed 2004·Granted Feb 27, 2007·24 cites·19 claims
- 1077US7150569B2Optical device mounted substrate assemblyNOR SPARK PLUG CO LTD·Filed 2004·Granted Dec 19, 2006·33 cites·13 claims
- 1174US7221829B2Substrate assembly for supporting optical component and method of producing the sameNGK SPARK PLUG CO·Filed 2004·Granted May 22, 2007·17 cites·16 claims
- 1272US6193910B1Paste for through-hole filling and printed wiring board using the sameNGK SPARK PLUG CO·Filed 1998·Granted Feb 27, 2001·37 cites·32 claims
- 1364US6770965B2Wiring substrate using embedding resinNGK SPARK PLUG CO·Filed 2001·Granted Aug 3, 2004·11 cites·6 claims
- 1456US4107503AMethod for eliminating residual magnetism in pipe-blank for welded steel pipe longitudinally seam-welded from insideNIPPON KOKAN KK·Filed 1977·Granted Aug 15, 1978·10 cites·7 claims
- 1552US6680123B2Embedding resinNGK SPARK PLUG CO·Filed 2001·Granted Jan 20, 2004·4 cites·17 claims
- 1650US7438969B2Filling material, multilayer wiring board, and process of producing multilayer wiring boardNGK SPARK PLUG CO·Filed 2003·Granted Oct 21, 2008·6 cites·8 claims
- 1743US2015310471A1Method and System for Social Gamification of Commercial OffersKOTOROV RADOSLAV P·Filed 2015·Application pending·0 cites
- 1837US2002147263A1Embedding resinNGK SPARK PLUG CO·Filed 2001·Application pending·0 cites
- 1935US4238659APreventing magnetization of pipe blank in GMA weldingNIPPON KOKAN KK·Filed 1979·Granted Dec 9, 1980·4 cites·3 claims
- 2030US4110589AMethod for longitudinally seam-welding pipe-blank for welded steel pipe from the inside along a grooveNIPPON KOKAN KK·Filed 1977·Granted Aug 29, 1978·2 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →