Inventor · disambiguated record
Toshikazu Komoda
Also filed as: KOMODA TOSHIKAZU
1 granted patent·16 pending applications·2 citations·filing 2004–2022
19Inventor score
Files withUDAGAWA HIROKO4KOMODA TOSHIKAZU3SEKISUI CHEMICAL CO LTD3SEKISUI MEDICAL CO LTD2TOYO INK SC HOLDINGS CO LTD2
Top patents by PatentIndex Score
17 records- 0157US9333182B2Adhesive patchKOMODA TOSHIKAZU·Filed 2012·Granted May 10, 2016·2 cites·6 claims
- 0253US2014242151A1Adhesive skin patchSEKISUI CHEMICAL CO LTD·Filed 2014·Application pending·0 cites
- 0351US2025017870A1Adhesive patch containing selexipag as active ingredientARTIENCE CO LTD·Filed 2022·Application pending·0 cites
- 0448US2014141059A1PatchSEKISUI MEDICAL CO LTD·Filed 2014·Application pending·0 cites
- 0546US2023390214A1Adhesive patchTOYO INK SC HOLDINGS CO LTD·Filed 2021·Application pending·0 cites
- 0646US2009258063A1Transdermal patchSEKISUI CHEMICAL CO LTD·Filed 2007·Application pending·0 cites
- 0746US2010047781A1Primer set for detection of dekkera yeast or brettanomyces yeastKIRIN BREWERY·Filed 2007·Application pending·0 cites
- 0842US2009317452A1Transdermal patchSEKISUI CHEMICAL CO TD·Filed 2007·Application pending·0 cites
- 0942US2007077285A1Adhesive skin patchUDAGAWA HIROKO·Filed 2004·Application pending·0 cites
- 1040US2016128948A1PatchSEKISUI MEDICAL CO LTD·Filed 2016·Application pending·0 cites
- 1140US2012114738A1Transdermal patchKOMODA TOSHIKAZU·Filed 2012·Application pending·0 cites
- 1239US2012195956A1Adhesive skin patchUDAGAWA HIROKO·Filed 2012·Application pending·0 cites
- 1336US2013202677A1PatchKOMODA TOSHIKAZU·Filed 2011·Application pending·0 cites
- 1436US2011135709A1Adhesive skin patchSEKISUI CHEMICAL CO LTD·Filed 2011·Application pending·0 cites
- 1531US2012171274A1Transdermal patchUDAGAWA HIROKO·Filed 2012·Application pending·0 cites
- 1624US2018028464A1Adhesive patchTOYO INK SC HOLDINGS CO LTD·Filed 2016·Application pending·0 cites
- 1713US2013287823A1PatchUDAGAWA HIROKO·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →