Inventor · disambiguated record
Toshinori Koyama
Also filed as: KOYAMA TOSHINORI
20 granted patents·3 pending applications·252 citations·filing 1999–2015
95Inventor score
Files withSHINKO ELECTRIC IND CO22
Top patents by PatentIndex Score
23 records- 0193US9820391B2Wiring boardSHINKO ELECTRIC IND CO·Filed 2015·Granted Nov 14, 2017·11 cites·17 claims
- 0293US9520352B2Wiring board and semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2015·Granted Dec 13, 2016·11 cites·9 claims
- 0391US9620446B2Wiring board, electronic component device, and method for manufacturing thoseSHINKO ELECTRIC IND CO·Filed 2015·Granted Apr 11, 2017·7 cites·9 claims
- 0490US9167692B2Wiring board, semiconductor device, and method of manufacturing wiring boardSHINKO ELECTRIC IND CO·Filed 2014·Granted Oct 20, 2015·11 cites·12 claims
- 0588US7057290B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2004·Granted Jun 6, 2006·30 cites·6 claims
- 0686US7285862B2Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation filmSHINKO ELECTRIC IND CO·Filed 2004·Granted Oct 23, 2007·27 cites·4 claims
- 0785US9455219B2Wiring substrate and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2013·Granted Sep 27, 2016·8 cites·5 claims
- 0885US9220167B2Wiring substrate, semiconductor device, and method of manufacturing wiring substrateSHINKO ELECTRIC IND CO·Filed 2015·Granted Dec 22, 2015·5 cites·10 claims
- 0983US7573135B2Electronic parts packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation filmSHINKO ELECTRIC IND CO·Filed 2007·Granted Aug 11, 2009·6 cites·4 claims
- 1082US7498200B2Electronic-parts-packaging structure in which a semiconductor chip is mounted on a wiring substrate and buried in an insulation filmSHINKO ELECTRIC IND CO·Filed 2007·Granted Mar 3, 2009·7 cites·12 claims
- 1182US6350365B1Method of producing multilayer circuit boardSHINKO ELECTRIC IND CO·Filed 2000·Granted Feb 26, 2002·36 cites·14 claims
- 1279US7964950B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2009·Granted Jun 21, 2011·5 cites·4 claims
- 1379US6759600B2Multilayer wiring board and method of fabrication thereofSHINKO ELECTRIC IND CO·Filed 2002·Granted Jul 6, 2004·35 cites·8 claims
- 1478US7545049B2Electronic parts packaging structureSHINKO ELECTRIC IND CO·Filed 2006·Granted Jun 9, 2009·5 cites·6 claims
- 1575US7691673B2Electronic parts packaging structure and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2006·Granted Apr 6, 2010·4 cites·5 claims
- 1667US6254758B1Method of forming conductor pattern on wiring boardSHINKO ELECTRIC IND CO·Filed 1999·Granted Jul 3, 2001·28 cites·10 claims
- 1766US7495745B2Patterning method and computer readable medium thereforSHINKO ELECTRIC IND CO·Filed 2007·Granted Feb 24, 2009·2 cites·10 claims
- 1865US6560863B2Method of producing wiring boardSHINKO ELECTRIC IND CO·Filed 2001·Granted May 13, 2003·13 cites·5 claims
- 1946US7307691B2Maskless direct exposure system and user interfaceSHINKO ELECTRIC IND CO·Filed 2004·Granted Dec 11, 2007·1 cites·22 claims
- 2045US9380707B2Method of manufacturing wiring substrateSHINKO ELECTRIC IND CO·Filed 2013·Granted Jun 28, 2016·0 cites·9 claims
- 2145US2008128911A1Semiconductor package and method for manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2007·Application pending·0 cites
- 2239US2006009026A1Method of fabricating wiring boardSHINKO ELECTRIC IND CO·Filed 2005·Application pending·0 cites
- 2335US2002083586A1Process for producing multilayer circuit boardFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →