Inventor · disambiguated record
Tong-Hua Kuan
Also filed as: KUAN TONG-HUA
7 granted patents·185 citations·filing 1999–2002
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG7
Top patents by PatentIndex Score
7 records- 0187US6291331B1Re-deposition high compressive stress PECVD oxide film after IMD CMP process to solve more than 5 metal stack via process IMD crack issueTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Sep 18, 2001·111 cites·21 claims
- 0269US6586347B1Method and structure to improve the reliability of multilayer structures of FSG (F-doped SiO2) dielectric layers and metal layers in semiconductor integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jul 1, 2003·16 cites·32 claims
- 0368US6531382B1Use of a capping layer to reduce particle evolution during sputter pre-clean proceduresTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 11, 2003·16 cites·22 claims
- 0464US6551927B1CoSix process to improve junction leakageTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Apr 22, 2003·13 cites·24 claims
- 0553US6645825B1Planarization of shallow trench isolation (STI)TAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Nov 11, 2003·6 cites·13 claims
- 0649US6248002B1Obtaining the better defect performance of the fuse CMP process by adding slurry polish on more soft pad after slurry polishTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jun 19, 2001·13 cites·33 claims
- 0743US6287172B1Method for improvement of tungsten chemical-mechanical polishing processTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Sep 11, 2001·10 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →