Inventor · disambiguated record
Toshiyuki Kuramochi
Also filed as: KURAMOCHI TOSHIYUKI
7 granted patents·1 pending application·198 citations·filing 1994–2008
87Inventor score
Top patents by PatentIndex Score
8 records- 0191US7432602B2Semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2006·Granted Oct 7, 2008·29 cites·4 claims
- 0286US5654590AMultichip-module having an HDI and a temporary supporting substrateFUJITSU LTD·Filed 1996·Granted Aug 5, 1997·90 cites·2 claims
- 0375US5521122AProcess of manufacturing a multichip module using a temporary support baseFUJITSU LTD·Filed 1994·Granted May 28, 1996·48 cites·7 claims
- 0473US7712649B2Using a simultaneously tilting and moving bonding apparatusSHINKO ELECTRIC IND CO·Filed 2008·Granted May 11, 2010·6 cites·6 claims
- 0570US7375433B2Semiconductor device packaging substrate and semiconductor device packaging structureSHINKO ELECTRIC IND CO·Filed 2006·Granted May 20, 2008·5 cites·10 claims
- 0657US8058562B2Wiring substrate and method of manufacturing the sameKURAMOCHI TOSHIYUKI·Filed 2008·Granted Nov 15, 2011·3 cites·9 claims
- 0746US5633532ASemiconductor device interconnectionFUJITSU LTD·Filed 1995·Granted May 27, 1997·17 cites·8 claims
- 0842US2007215927A1Semiconductor device and manufacturing method thereofSHINKO ELECTRIC IND CO·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →