Inventor · disambiguated record
Tom Lao
Also filed as: LAO TOM · LAO TOM Q · LAO TOM QUOC
10 granted patents·121 citations·filing 1994–2006
89Inventor score
Top patents by PatentIndex Score
10 records- 0172US5570273ASurface mountable integrated circuit package with low-profile detachable moduleSGS THOMSON MICROELECTRONICS·Filed 1994·Granted Oct 29, 1996·47 cites·16 claims
- 0270US7534716B2System and method for venting pressure from an integrated circuit package sealed with a lidST MICROELECTRONICS INC·Filed 2006·Granted May 19, 2009·4 cites·20 claims
- 0370US7126210B2System and method for venting pressure from an integrated circuit package sealed with a lidST MICROELECTRONICS INC·Filed 2003·Granted Oct 24, 2006·15 cites·20 claims
- 0470US6437984B1Thermally enhanced chip scale packageST MICROELECTRONICS INC·Filed 2000·Granted Aug 20, 2002·17 cites·20 claims
- 0564US6372543B1Wrap-around interconnect for fine pitch ball grid arrayST MICROELECTRONICS INC·Filed 2000·Granted Apr 16, 2002·10 cites·20 claims
- 0658US6846186B2BGA memory module with battery packST MICROELECTRONICS INC·Filed 2002·Granted Jan 25, 2005·5 cites·20 claims
- 0752US6121678AWrap-around interconnect for fine pitch ball grid arrayST MICROELECTRONICS INC·Filed 1997·Granted Sep 19, 2000·15 cites·19 claims
- 0850US7456050B2System and method for controlling integrated circuit die height and planarityST MICROELECTRONICS INC·Filed 2003·Granted Nov 25, 2008·4 cites·6 claims
- 0938USD354275SLow-profile detachable integrated circuit moduleSGS THOMSON MICROELECTRONICS INC·Filed 1994·Granted Jan 10, 1995·3 cites·1 claims
- 1032USD354274SLow-profile detachable integrated circuit moduleSGS THOMSON MICROELECTRONICS INC·Filed 1994·Granted Jan 10, 1995·1 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →