Inventor · disambiguated record
Toru Mikami
Also filed as: MIKAMI TORU
10 granted patents·2 pending applications·88 citations·filing 1993–2015
87Inventor score
Top patents by PatentIndex Score
12 records- 0189US7348192B2Method for monitoring film thickness, a system for monitoring film thickness, a method for manufacturing a semiconductor device, and a program product for controlling film thickness monitoring systemTOSHIBA KK·Filed 2004·Granted Mar 25, 2008·46 cites·6 claims
- 0284US7483155B2Structure inspection method, pattern formation method, process condition determination method and resist pattern evaluation apparatusTOSHIBA KK·Filed 2005·Granted Jan 27, 2009·6 cites·10 claims
- 0377US7573582B2Method for monitoring film thickness, a system for monitoring film thickness, a method for manufacturing a semiconductor device, and a program product for controlling film thickness monitoring systemTOSHIBA KK·Filed 2008·Granted Aug 11, 2009·9 cites·6 claims
- 0465US6825938B2Film thickness measuring method and step measuring methodTOSHIBA KK·Filed 2002·Granted Nov 30, 2004·14 cites·12 claims
- 0561US6563594B2Mark position detecting system and method for detecting mark positionTOSHIBA KK·Filed 2001·Granted May 13, 2003·7 cites·12 claims
- 0657US7164628B2Optical disk deviceTEAC CORP·Filed 2002·Granted Jan 16, 2007·3 cites·15 claims
- 0756US7903264B2Structure inspection method, pattern formation method, process condition determination method and resist pattern evaluation apparatusTOSHIBA KK·Filed 2008·Granted Mar 8, 2011·0 cites·37 claims
- 0847US7289232B2Dimension measurement method, method of manufacturing semiconductor device, dimension measurement apparatus and measurement markTOSHIBA KK·Filed 2004·Granted Oct 30, 2007·0 cites·14 claims
- 0942US9612108B2Measurement apparatus and measurement methodTOSHIBA KK·Filed 2015·Granted Apr 4, 2017·0 cites·6 claims
- 1041US2014238605A1Film thickness monitoring method, film thickness monitoring device, and semiconductor manufacturing apparatusTOSHIBA KK·Filed 2013·Application pending·0 cites
- 1141US2014224425A1Film thickness monitoring method, film thickness monitoring device, and semiconductor manufacturing apparatusTOSHIBA KK·Filed 2013·Application pending·0 cites
- 1236US5426540ADigital audio reproducing apparatusTEAC CORP·Filed 1993·Granted Jun 20, 1995·3 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →