Inventor · disambiguated record
Tomoyuki Mitsui
Also filed as: MITSUI TOMOYUKI
9 granted patents·4 pending applications·16 citations·filing 2008–2020
81Inventor score
Top patents by PatentIndex Score
13 records- 0186US10772187B2Electronic equipment and electronic deviceNEC CORP·Filed 2019·Granted Sep 8, 2020·5 cites·7 claims
- 0276US10888019B2Electronic deviceNEC CORP·Filed 2019·Granted Jan 5, 2021·2 cites·6 claims
- 0371US7595993B2Mounting structure with heat sink for electronic component and female securing member for sameMITSUI TOMOYUKI·Filed 2008·Granted Sep 29, 2009·5 cites·16 claims
- 0462US9870973B2Cooling device and deviceNEC CORP·Filed 2016·Granted Jan 16, 2018·1 cites·9 claims
- 0561US8240965B2Mounting structure with heat sink for electronic component and female securing member for sameMITSUI TOMOYUKI·Filed 2009·Granted Aug 14, 2012·2 cites·4 claims
- 0659US9740251B2Cooling device and deviceNEC CORP·Filed 2016·Granted Aug 22, 2017·1 cites·5 claims
- 0743US2021059075A1Heat radiation component and mounting substrateNEC CORP·Filed 2020·Application pending·0 cites
- 0841US9759496B2Heat sink, heat dissipating structure, cooling structure and deviceNEC CORP·Filed 2016·Granted Sep 12, 2017·0 cites·16 claims
- 0940US8998689B2Cooling mechanismMITSUI TOMOYUKI·Filed 2008·Granted Apr 7, 2015·0 cites·2 claims
- 1037US10755997B2Cooling device and mounting methodNEC CORP·Filed 2017·Granted Aug 25, 2020·0 cites·16 claims
- 1132US2016282065A1Heat sink, cooling structure, and apparatusNEC CORP·Filed 2016·Application pending·0 cites
- 1232US2016284622A1Cooling structure and deviceNEC CORP·Filed 2016·Application pending·0 cites
- 1331US2015257307A1Heat sinkNEC CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →