Inventor · disambiguated record
Toshihiro Miyake
Also filed as: MIYAKE TOSHIHIRO
34 granted patents·2 pending applications·566 citations·filing 1994–2021
97Inventor score
Top patents by PatentIndex Score
36 records- 0198US7433019B2Exposure apparatus and device manufacturing methodNIKON CORP·Filed 2006·Granted Oct 7, 2008·66 cites·49 claims
- 0293US7931502B2Card edge connector and method for assembling the sameDENSO CORP·Filed 2010·Granted Apr 26, 2011·30 cites·14 claims
- 0392US8187038B2Card edge connector and method of manufacturing the sameKAMIYA TAKASHI·Filed 2010·Granted May 29, 2012·33 cites·19 claims
- 0491US6449836B1Method for interconnecting printed circuit boards and interconnection structureDENSO CORP·Filed 2000·Granted Sep 17, 2002·78 cites·29 claims
- 0590US6680441B2Printed wiring board with embedded electric device and method for manufacturing printed wiring board with embedded electric deviceDENSO CORP·Filed 2002·Granted Jan 20, 2004·44 cites·24 claims
- 0689US9970121B2Composite material, method for forming the composite material, electrode plated with the composite material, and connection structure having the composite materialDENSO CORP·Filed 2015·Granted May 15, 2018·2 cites·13 claims
- 0788US7748988B2Card edge connector and method of manufacturing the sameDENSO CORP·Filed 2008·Granted Jul 6, 2010·32 cites·12 claims
- 0885US7628654B2Card edge connector and method of manufacturing the sameNIPPON SOKEN·Filed 2008·Granted Dec 8, 2009·25 cites·13 claims
- 0981US5511719AProcess of joining metal membersNIPPON DENSO CO·Filed 1994·Granted Apr 30, 1996·45 cites·5 claims
- 1080US6784375B2Interconnection structure for interconnecting printed circuit boardsDENSO CORP·Filed 2002·Granted Aug 31, 2004·23 cites·25 claims
- 1179US6499217B1Method of manufacturing three-dimensional printed wiring boardMITSUBISHI PLASTICS INC·Filed 2000·Granted Dec 31, 2002·27 cites·6 claims
- 1276US9743531B2Electronic apparatus and manufacturing method of electronic apparatusDENSO CORP·Filed 2016·Granted Aug 22, 2017·2 cites·10 claims
- 1375US9698506B2Electric connection structureDENSO CORP·Filed 2015·Granted Jul 4, 2017·4 cites·21 claims
- 1475US9093780B2Press-fit pin, connection structure including the press-fit pin, and electronic device including the press-fit pinDENSO CORP·Filed 2013·Granted Jul 28, 2015·8 cites·3 claims
- 1575US6966482B2Connecting structure of printed circuit boardsDENSO CORP·Filed 2003·Granted Nov 22, 2005·17 cites·10 claims
- 1674US7165321B2Method for manufacturing printed wiring board with embedded electric deviceDENSO CORP·Filed 2003·Granted Jan 23, 2007·15 cites·7 claims
- 1773US6605357B1Bonding method and bonding structure of thermoplastic resin materialDENSO CORP·Filed 2000·Granted Aug 12, 2003·12 cites·15 claims
- 1872US6527162B2Connecting method and connecting structure of printed circuit boardsDENSO CORP·Filed 2001·Granted Mar 4, 2003·15 cites·14 claims
- 1964US7481353B2Metal bonding methodDENSO CORP·Filed 2005·Granted Jan 27, 2009·2 cites·11 claims
- 2063US7417195B2Circuit board and circuit board connection structureDENSO CORP·Filed 2004·Granted Aug 26, 2008·10 cites·17 claims
- 2162US7080445B2Method for connecting printed circuit boards and connected printed circuit boardsDENSO CORP·Filed 2002·Granted Jul 25, 2006·11 cites·21 claims
- 2262US5669548ASoldering methodNIPPON DENSO CO·Filed 1996·Granted Sep 23, 1997·22 cites·10 claims
- 2360US9305676B2Composite material, electric contact electrode, electric contact film, conductive filler, electric contact structure using composite material, and manufacturing method of composite materialDENSO CORP·Filed 2012·Granted Apr 5, 2016·0 cites·12 claims
- 2459US6601754B2Method of connecting circuit boardsDENSO CORP·Filed 2001·Granted Aug 5, 2003·6 cites·3 claims
- 2557US12041753B2Electronic deviceDENSO CORP·Filed 2021·Granted Jul 16, 2024·0 cites·20 claims
- 2657US11538733B2Electronic deviceDENSO CORP·Filed 2020·Granted Dec 27, 2022·0 cites·11 claims
- 2756US7286367B2Printed circuit board with a built-in passive device, manufacturing method of the printed circuit board, and elemental board for the printed circuit boardDENSO CORP·Filed 2003·Granted Oct 23, 2007·8 cites·20 claims
- 2856US6657137B2Connection structure and connection method of for connecting two circuit boardsDENSO CORP·Filed 2001·Granted Dec 2, 2003·6 cites·26 claims
- 2954US11849566B2Joint structure, electronic device and method for manufacturing the joint structureDENSO CORP·Filed 2021·Granted Dec 19, 2023·0 cites·5 claims
- 3054US6769598B2Method of connecting circuit boardsDENSO CORP·Filed 2003·Granted Aug 3, 2004·4 cites·10 claims
- 3154US6719187B2Method of connecting circuit boardsDENSO CORP·Filed 2003·Granted Apr 13, 2004·5 cites·30 claims
- 3249US6598780B2Method of connecting circuit boardsDENSO CORP·Filed 2000·Granted Jul 29, 2003·3 cites·5 claims
- 3347US6218030B1Soldered productNIPPON DENSO CO·Filed 1997·Granted Apr 17, 2001·11 cites·11 claims
- 3440US2011059661A1Electrical connector assembly for connecting printed circuit board and electrical component, and electric deviceDENSO CORP·Filed 2010·Application pending·0 cites
- 3537US2003020888A1Exposure apparatus, exposure method, method of adjusting pressure of projection optical system and method of assembling exposure apparatusNIKON CORP·Filed 2002·Application pending·0 cites
- 3635US6562147B2Soldered productDENSO CORP·Filed 2001·Granted May 13, 2003·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →