Inventor · disambiguated record
Toshiyuki Moribayashi
Also filed as: MORIBAYASHI TOSHIYUKI
4 granted patents·7 pending applications·6 citations·filing 2001–2022
60Inventor score
Top patents by PatentIndex Score
11 records- 0150US11645910B2Information processing apparatus, system, and method that estimates time for a user to travel from departure location to destination location based on stop information of other users at facilities on a route to the destination locationDENSO TEN LTD·Filed 2021·Granted May 9, 2023·0 cites·16 claims
- 0250US2009173770A1Lead-free solder alloy and electoronic component using this lead-free solder alloyNIPPON GENMA KK·Filed 2009·Application pending·0 cites
- 0350US2023188939A1Information processing apparatus, information processing system, and information processing methodDENSO TEN LTD·Filed 2022·Application pending·0 cites
- 0449US12340695B2Vehicle dispatch device, vehicle dispatch system, on-vehicle device, and vehicle dispatch methodDENSO TEN LTD·Filed 2020·Granted Jun 24, 2025·0 cites·8 claims
- 0547US7005106B2Lead-free solder alloy and electronic components using itNIPPON GENMA KK·Filed 2001·Granted Feb 28, 2006·6 cites·3 claims
- 0647US2006024194A1Lead-free solder alloy and electronic component using this lead-free solder alloyNIPPON GENMA KK·Filed 2005·Application pending·0 cites
- 0745US2025016919A1Magnetic ceramic substrate, substrate manufacturing method, and circulatorMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 0844US2023160702A1Information processing apparatus, information processing system, and information processing methodDENSO TEN LTD·Filed 2021·Application pending·0 cites
- 0938US11959766B2In-vehicle apparatus, distribution system, and video receiving methodDENSO TEN LTD·Filed 2020·Granted Apr 16, 2024·0 cites·16 claims
- 1038US2022132708A1Shield caseMITSUBISHI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 1127US2003091463A1Unleaded solder alloy and electronic components using itFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →