Inventor · disambiguated record
Toshiaki Morita
Also filed as: MAKINO FUSAO · MORITA TOSHIAKI
79 granted patents·23 pending applications·1,396 citations·filing 1978–2023
99Inventor score
Files withSHIMA SEIKI MFG29HITACHI LTD20RENESAS TECH CORP8SHARP KK8HITACHI POWER SEMICONDUCTOR DEVICE LTD5
Top patents by PatentIndex Score
102 records- 0198US6774466B1Semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted Aug 10, 2004·162 cites·2 claims
- 0296US6798072B2Flip chip assembly structure for semiconductor device and method of assembling thereforHITACHI LTD·Filed 2001·Granted Sep 28, 2004·144 cites·12 claims
- 0395US6879041B2Semiconductor device with joint structure having lead-free solder layer over nickel layerRENESAS TECH CORP·Filed 2003·Granted Apr 12, 2005·87 cites·5 claims
- 0494US7985991B2MOSFET packageRENESAS ELECTRONICS CORP·Filed 2008·Granted Jul 26, 2011·16 cites·30 claims
- 0593US4499239AResin composition for powder coatingDAINIPPON INK & CHEMICALS·Filed 1981·Granted Feb 12, 1985·82 cites·15 claims
- 0692US7589400B2Inverter and vehicle drive unit using the sameHITACHI LTD·Filed 2005·Granted Sep 15, 2009·29 cites·4 claims
- 0791US8183607B2Semiconductor deviceKAJIWARA RYOICHI·Filed 2011·Granted May 22, 2012·8 cites·4 claims
- 0890US7400002B2MOSFET packageRENESAS TECH CORP·Filed 2006·Granted Jul 15, 2008·11 cites·20 claims
- 0990US7332757B2MOSFET packageRENESAS TECH CORP·Filed 2006·Granted Feb 19, 2008·11 cites·8 claims
- 1089US7342267B2MOSFET packageRENESAS TECH CORP·Filed 2006·Granted Mar 11, 2008·10 cites·48 claims
- 1189US6784554B2Semiconductor device and manufacturing method thereofHITACHI LTD·Filed 2002·Granted Aug 31, 2004·49 cites·10 claims
- 1288US7955411B2Low temperature bonding material comprising metal particles and bonding methodHITACHI LTD·Filed 2007·Granted Jun 7, 2011·13 cites·22 claims
- 1387US7542317B2Semiconductor device and power conversion apparatus using the sameHITACHI LTD·Filed 2006·Granted Jun 2, 2009·16 cites·7 claims
- 1486US8455986B2Mosfet packageKAJIWARA RYOICHI·Filed 2012·Granted Jun 4, 2013·4 cites·12 claims
- 1586US5573442AApparatus for measuring a cutting blade width in a cutting apparatusSHIMA SEIKI MFG·Filed 1994·Granted Nov 12, 1996·59 cites·19 claims
- 1685US7393771B2Method for mounting an electronic part on a substrate using a liquid containing metal particlesHITACHI LTD·Filed 2004·Granted Jul 1, 2008·33 cites·13 claims
- 1785US6895785B2Yarn carrier of weft knitting deviceSHIMA SEIKI MFG·Filed 2002·Granted May 24, 2005·20 cites·6 claims
- 1885US6568222B1Sinker device of flat knitting machineSHIMA SEIKI MFG·Filed 2000·Granted May 27, 2003·20 cites·6 claims
- 1984US7528485B2Semiconductor device, power converter device using it, and hybrid vehicle using the power converter deviceHITACHI LTD·Filed 2005·Granted May 5, 2009·13 cites·8 claims
- 2084US7272959B2Removable moving member for knitting and weft knitting machine provided with knitting member switching apparatusSHIMA SEIKI MFG·Filed 2004·Granted Sep 25, 2007·24 cites·14 claims
- 2183US8400777B2Electronic member, electronic part and manufacturing method thereforIDE EIICHI·Filed 2010·Granted Mar 19, 2013·6 cites·6 claims
- 2282US8181268B2Scanning probe microscope and method of observing sample using the sameNAKATA TOSHIHIKO·Filed 2008·Granted May 15, 2012·6 cites·20 claims
- 2381US6915667B2Composite needle of knitting machineSHIMA SEIKI MFG·Filed 2002·Granted Jul 12, 2005·16 cites·4 claims
- 2481US6900551B2Semiconductor device with alternate bonding wire arrangementHITACHI ULSI SYS CO LTD·Filed 2003·Granted May 31, 2005·28 cites·13 claims
- 2580US7579805B2Semiconductor deviceHITACHI LTD·Filed 2004·Granted Aug 25, 2009·30 cites·10 claims
- 2680US6568223B1Guide mechanism of knitting member and compound needle assembling the guide mechanism thereinSHIMA SEIKI MFG·Filed 2000·Granted May 27, 2003·16 cites·7 claims
- 2778US7394146B2MOSFET packageRENESAS TEHCNOLOGY CORP·Filed 2006·Granted Jul 1, 2008·5 cites·30 claims
- 2877US8840811B2Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the sameYASUDA YUUSUKE·Filed 2010·Granted Sep 23, 2014·8 cites·16 claims
- 2977US5694792ANeedle selection device of flat knitting machineSHIMA SEIKI MFG·Filed 1996·Granted Dec 9, 1997·18 cites·6 claims
- 3076US9404010B2Method for forming multilayer coating filmKANSAI PAINT CO LTD·Filed 2013·Granted Aug 2, 2016·2 cites·16 claims
- 3176US6579623B2Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material memberHITACHI LTD·Filed 2002·Granted Jun 17, 2003·20 cites·16 claims
- 3276US6422045B1Compound needle of knitting machineSHIMA SEIKI MFG·Filed 2000·Granted Jul 23, 2002·14 cites·16 claims
- 3376US5369966AMethod and apparatus for yarn processing position control of flat knitting machineSHIMA SEIKI MFG·Filed 1993·Granted Dec 6, 1994·18 cites·10 claims
- 3475US6339942B1Compound needle with asymmetrically divided closing elementGROZ BECKERT KG·Filed 2000·Granted Jan 22, 2002·15 cites·15 claims
- 3574US5062047ATranslation method and apparatus using optical character readerSHARP KK·Filed 1989·Granted Oct 29, 1991·49 cites·2 claims
- 3674US4607386AHandwritten character recognition deviceSHARP KK·Filed 1984·Granted Aug 19, 1986·47 cites·2 claims
- 3773US8821676B2Low temperature bonding material comprising coated metal nanoparticles, and bonding methodYASUDA YUSUKE·Filed 2011·Granted Sep 2, 2014·3 cites·7 claims
- 3873US7372132B2Resin encapsulated semiconductor device and the production methodHITACHI LTD·Filed 2005·Granted May 13, 2008·7 cites·13 claims
- 3973US7289869B2Knitting method and system using stretch yarnSHIMA SEIKI MFG·Filed 2004·Granted Oct 30, 2007·10 cites·8 claims
- 4072US8635710B2Scanning probe microscope and method of observing sample using the sameNAKATA TOSHIHIKO·Filed 2012·Granted Jan 21, 2014·2 cites·12 claims
- 4172US4193056AOCR for reading a constraint free hand-written character or the likeSHARP KK·Filed 1978·Granted Mar 11, 1980·20 cites·2 claims
- 4271US8513534B2Semiconductor device and bonding materialMORITA TOSHIAKI·Filed 2009·Granted Aug 20, 2013·6 cites·15 claims
- 4370US8821768B2Bonding method and bonding material using metal particleYASUDA YUSUKE·Filed 2007·Granted Sep 2, 2014·5 cites·14 claims
- 4468US8912644B2Semiconductor device and method for manufacturing sameHITACHI LTD·Filed 2013·Granted Dec 16, 2014·2 cites·10 claims
- 4568US8592996B2Semiconductor device and method of manufacturing the sameMORITA TOSHIAKI·Filed 2010·Granted Nov 26, 2013·3 cites·19 claims
- 4668US7449786B2Semiconductor device having improved adhesion between bonding and ball portions of electrical connectorsRENESAS TECH CORP·Filed 2006·Granted Nov 11, 2008·6 cites·8 claims
- 4767US7218988B2Yarn feeding apparatus of weft knitting machineSHIMA SEIKI MFG·Filed 2004·Granted May 15, 2007·9 cites·7 claims
- 4866US7055349B2Yarn feeding device for flat knitting machineSHIMA SEIKI MFG·Filed 2003·Granted Jun 6, 2006·8 cites·17 claims
- 4965US7049214B2Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectorsRENESAS TECH CORP·Filed 2004·Granted May 23, 2006·8 cites·13 claims
- 5064US6119486AEnd yarn inserting device of flat knitting machineSHIMA SEIKI MFG·Filed 1999·Granted Sep 19, 2000·13 cites·4 claims
Showing the top 50 of 102 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →