Inventor · disambiguated record
Toshimitsu Moriya
Also filed as: MORIYA TOSHIMITSU
3 granted patents·3 pending applications·0 citations·filing 2019–2024
40Inventor score
Top patents by PatentIndex Score
6 records- 0169US2025083262A1Solder particles and method for producing solder particlesRESONAC CORP·Filed 2024·Application pending·0 cites
- 0265US12172240B2Solder particlesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Dec 24, 2024·0 cites·11 claims
- 0361US2024209182A1Hardener, adhesive composition, adhesive film for circuit connection, connected structure, and method for producing connected structureRESONAC CORP·Filed 2022·Application pending·0 cites
- 0456US12247270B2Anisotropic conductive film and method for producing the anisotropic conductive film including a base material having recesses and solder particles formed inside the recessesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Mar 11, 2025·0 cites·12 claims
- 0550US12100923B2Connection structure and manufacturing method thereforSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Sep 24, 2024·0 cites·6 claims
- 0650US2021229222A1Solder particles and method for producing solder particlesSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →