Inventor · disambiguated record
Tomoo Murakami
Also filed as: MURAKAMI TOMOO
22 granted patents·5 pending applications·530 citations·filing 1987–2012
96Inventor score
Top patents by PatentIndex Score
27 records- 0198US5874780AMethod of mounting a semiconductor device to a substrate and a mounted structureNEC CORP·Filed 1996·Granted Feb 23, 1999·151 cites·5 claims
- 0295US7902678B2Semiconductor device and manufacturing method thereofNEC CORP·Filed 2005·Granted Mar 8, 2011·86 cites·14 claims
- 0379US8237292B2Semiconductor device and method for manufacturing the sameSHIBUYA AKINOBU·Filed 2008·Granted Aug 7, 2012·8 cites·8 claims
- 0479US6212768B1Flip chip mounting method and apparatus thereforNEC CORP·Filed 1999·Granted Apr 10, 2001·56 cites·14 claims
- 0577US8133577B2Silicon-nitrogen compound film, and gas-barrier film and thin-film device using the silicon-nitrogen compound filmKURAMACHI TERUHIKO·Filed 2008·Granted Mar 13, 2012·7 cites·5 claims
- 0671US6133066ASemiconductor element mounting methodNEC CORP·Filed 1999·Granted Oct 17, 2000·37 cites·7 claims
- 0770US6958206B2Image recording material and lithographic printing plate precursorFUJI PHOTO FILM CO LTD·Filed 2003·Granted Oct 25, 2005·6 cites·1 claims
- 0870US5464662AFabrication method of printed wiring boardNEC CORP·Filed 1994·Granted Nov 7, 1995·27 cites·8 claims
- 0969US8057904B2Gas-barrier film and deviceMURAKAMI TOMOO·Filed 2008·Granted Nov 15, 2011·5 cites·14 claims
- 1069US5499446AMethod for manufacturing printed circuit board with through-holeNEC CORP·Filed 1994·Granted Mar 19, 1996·29 cites·6 claims
- 1167US6069024AMethod for producing a semiconductor deviceNEC CORP·Filed 1999·Granted May 30, 2000·33 cites·7 claims
- 1266US4777113ASilver halide photographic material containing a silica containing overlayer and specific hydrazine derivativesFUJI PHOTO FILM CO LTD·Filed 1987·Granted Oct 11, 1988·24 cites·13 claims
- 1364US8236912B2Gas-barrier film and environment-sensitive deviceMURAKAMI TOMOO·Filed 2008·Granted Aug 7, 2012·2 cites·13 claims
- 1460US8669138B2Semiconductor device and method for manufacturing the sameSHIBUYA AKINOBU·Filed 2012·Granted Mar 11, 2014·1 cites·14 claims
- 1558US6599777B2Method for mounting flip chip on circuit board through reliable electrical connections at low contact resistanceNEC CORP·Filed 2001·Granted Jul 29, 2003·8 cites·24 claims
- 1656US5480675AMethod of and apparatus for plating printed circuit boardNEC CORP·Filed 1994·Granted Jan 2, 1996·20 cites·9 claims
- 1750US5499447AMethod for manufacturing a printed circuit board having electrodes on end surface of substrateNEC CORP·Filed 1994·Granted Mar 19, 1996·13 cites·8 claims
- 1849US6449838B2Method of mounting a semiconductor device to a substrateNEC CORP·Filed 1998·Granted Sep 17, 2002·9 cites·8 claims
- 1947US8758889B2Gas barrier film and deviceMURAKAMI TOMOO·Filed 2011·Granted Jun 24, 2014·0 cites·16 claims
- 2046US8475877B2Method for counteracting curling tendency of gas barrier film, method for producing gas barrier film, and method for producing electronic deviceMURAKAMI TOMOO·Filed 2010·Granted Jul 2, 2013·0 cites·20 claims
- 2146US8120921B2Device having electronic components mounted therein and method for manufacturing such deviceYAMAZAKI TAKAO·Filed 2008·Granted Feb 21, 2012·0 cites·15 claims
- 2245US2009197101A1Gas barrier layer deposition method, gas barrier film and organic el deviceFUJIFILM CORP·Filed 2009·Application pending·0 cites
- 2340US5968589AMethod for manufacturing wiring pattern boardNEC CORP·Filed 1997·Granted Oct 19, 1999·8 cites·5 claims
- 2440US2002059722A1Method of mounting a semiconductor device to a substrate and a mounted structureNEC CORP·Filed 2002·Application pending·0 cites
- 2536US2011052892A1Gas barrier film and deviceMURAKAMI TOMOO·Filed 2010·Application pending·0 cites
- 2635US2001016372A1Mounting method and apparatus of bare chipsNEC CORP·Filed 2001·Application pending·0 cites
- 2735US2001010393A1Semiconductor device and semiconductor device mounting method thereofNEC CORP·Filed 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →