Inventor · disambiguated record
Tomohiro Nagoya
Also filed as: NAGOYA TOMOHIRO
9 granted patents·3 pending applications·16 citations·filing 2002–2021
79Inventor score
Top patents by PatentIndex Score
12 records- 0169US11251055B2Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2019·Granted Feb 15, 2022·1 cites·16 claims
- 0268US6849385B2Photosensitive resin composition, process of forming patterns with the same, and electronic componentsHITACHI CHEMICAL CO LTD·Filed 2002·Granted Feb 1, 2005·10 cites·33 claims
- 0367US7843045B2Thermoplastic resin composition for semiconductor, adhesion film, lead frame, and semiconductor device using the same, and method of producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2006·Granted Nov 30, 2010·5 cites·20 claims
- 0463US11682564B2Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulated molded body provided with temporary protective film, and method for manufacturing semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·22 claims
- 0552US12435248B2Temporary protective film for semiconductor encapsulation molding, lead frame provided with temporary protective film, encapsulation molded body, and method for manufacturing semiconductor packageRESONAC CORP·Filed 2021·Granted Oct 7, 2025·0 cites·8 claims
- 0649US11908762B2Temporary protective film for semiconductor sealing molding, lead frame with temporary protective film, sealed molded body with temporary protective film, and method for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2019·Granted Feb 20, 2024·0 cites·16 claims
- 0748US11195728B2Temporary protective film for semiconductor sealing moldingHITACHI CHEMICAL CO LTD·Filed 2018·Granted Dec 7, 2021·0 cites·14 claims
- 0847US2023178385A1Temporary protection film for semiconductor encapsulation, production method therefor, lead frame with temporary protection film, temporarily protected encapsulation object, and method for producing semiconductor packageSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 0944US12451367B2Temporary protective film for semiconductor encapsulation molding, lead frame with temporary protective film, encapsulation molded body with temporary protective film, and method for manufacturing semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Oct 21, 2025·0 cites·9 claims
- 1044US12398298B2Temporary protective film for producing semiconductor device, reel body, and method for producing semiconductor deviceRESONAC CORP·Filed 2019·Granted Aug 26, 2025·0 cites·11 claims
- 1142US2022285200A1Temporary protective film, reel body, packaging body, package body, temporary protective body, and method for producing semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 1234US2005255278A1Adhesive film, lead frame with adhesive film, and semiconductor device using sameMATSUURA HIDEKAZU·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →